Sr. Device Integration and Innovation Engineering (Logic and/or Memory)

Location: Santa Clara, California, United States; travel required up to 10% of the time. Relocation eligible.

Salary: $163,000–$224,000 per year

Company

hirify.global develops materials science and engineering solutions for semiconductor chips and advanced display manufacturing.

What you will do

• Lead FEOL, MEOL, and BEOL integration projects for advanced logic and memory technologies.
• Provide technical leadership for module development across channels, junctions, gates, contacts, interconnects, NAND, and DRAM.
• Design, plan, and execute process engineering projects for integrated materials solutions.
• Work with customers and business units to resolve complex process engineering issues and address high-value problems.
• Design experiments, collect and analyze data, troubleshoot engineering issues, and prepare technical reports and product specifications.
• Lead multidisciplinary research and development initiatives and develop technologies that support logic and memory scaling.

Requirements

• Bachelor's degree.
• 10–15 years of experience.
• In-depth expertise in logic and/or memory technology and CMOS logic transistor formation.
• Experience leading complex, high-risk projects and developing execution strategies.
• Ability to solve unique, complex problems through conceptual and innovative thinking.
• Ability to communicate complex ideas and influence senior stakeholders.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Work with global R&D teams on advanced semiconductor and display technologies.
• Comprehensive benefits supporting employee health and wellbeing.
• Potential eligibility for bonus and stock award programs.
• Opportunity to contribute to patented technologies, published research, and long-term product development.