Sr. Device Integration and Innovation Engineering (Logic and/or Memory)

Location: Santa Clara, California, United States. Relocation eligible; travel required approximately 10% of the time.

Salary: $163,000–$224,000 per year.

Company

hirify.global develops materials engineering solutions and equipment used in semiconductor and display manufacturing.

What you will do

• Lead FEOL, MEOL, and BEOL integration projects for advanced Logic and Memory technologies.
• Provide technical leadership for module development across channels, junctions, gates, contacts, interconnects, NAND, and DRAM.
• Design, implement, and validate new integrated materials solutions and process technologies.
• Plan and execute complex process engineering projects, experiments, data collection, analysis, and technical reporting.
• Collaborate with customers, business units, vendors, suppliers, and R&D teams to resolve complex process engineering issues.
• Develop technical documentation, product specifications, presentations, and research contributions including patents and publications.

Requirements

• Bachelor’s degree.
• 10–15 years of relevant experience.
• Expertise in Logic and/or Memory technology and in-depth knowledge of CMOS logic transistor formation.
• Experience leading high-risk, complex engineering projects and developing execution strategies.
• Ability to solve unique, complex problems through conceptual and innovative thinking.
• Ability to communicate complex technical ideas and influence senior stakeholders.

Culture & Benefits

• Supportive environment focused on learning, professional development, and technical innovation.
• Comprehensive employee benefits package.
• Potential eligibility for bonus and stock award programs.
• Opportunity to collaborate with global R&D teams on semiconductor and display technology projects.