Advanced Packaging Technology Development Process Integration Engineer

Location: On-site in Albuquerque/Rio Rancho, New Mexico, United States

Annual salary: $115,110–$219,550 USD

Company

hirify.global develops semiconductor technologies, advanced packaging solutions, and high-volume manufacturing capabilities.

What you will do

• Develop and qualify upcoming advanced packaging technology nodes.
• Drive closure of defect, yield, reliability, and device entitlement gaps.
• Support process readiness reviews and technology transfer to high-volume manufacturing.
• Partner with process module, device, yield, reliability, packaging, and external stakeholder teams.
• Develop robust base die solutions and contribute to value engineering initiatives.
• Lead cross-functional problem-solving in a technically complex manufacturing environment.

Requirements

• Bachelor’s degree in engineering, materials science, physics, or a related field with 3+ years of relevant experience, or a master’s degree with 2+ years, or a PhD with no prior experience required.
• Experience in technology development or high-volume manufacturing.
• Knowledge of process integration, yield analysis, quality management, defect reduction, and process development.
• Knowledge of semiconductor advanced packaging techniques and flows.
• Clear technical communication, cross-functional collaboration, ownership, adaptability, and creative problem-solving skills.

Nice to have

• Experience with 2.5D, 3D IC, fan-out, or flip-chip advanced packaging technologies.
• Experience supporting technology transfer to high-volume manufacturing.
• Experience leading cross-functional problem-solving initiatives and applying value engineering.

Culture & Benefits

• Collaborative engineering environment focused on advanced semiconductor manufacturing.
• Health, retirement, and vacation benefits.
• Competitive pay and stock bonuses.
• Shift 1 schedule in the United States.