Tech Proj/Prog Manager IV (Semiconductor Equipment)

Location: Santa Clara, California, United States. Full-time onsite role; travel required approximately 10% of the time. Relocation is not available.

Salary: $110,500–$152,000 per year, plus potential bonus and stock award compensation.

Company

hirify.global develops materials science, engineering, and semiconductor manufacturing solutions used in advanced chips and displays.

What you will do

• Own the special substrate handling product vision, strategy, roadmap, and business case across business units.
• Align system-level requirements across platform centers of excellence, business units, customers, vendors, and engineering teams.
• Translate customer challenges and advanced packaging trends into prioritized product and platform requirements.
• Lead cross-functional roadmap planning across hardware, software, automation, robotics, metrology, and subsystem teams.
• Serve as the system integration leader for SSH capabilities across multiple product platforms.
• Establish governance and program management processes while developing growth strategies for advanced packaging and AI-driven manufacturing.

Requirements

• 10+ years of experience in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development.
• Deep experience in semiconductor equipment, automation, robotics, substrate handling, or system integration.
• Ability to operate as a product manager, systems architect, and program manager.
• Strong technical credibility with engineering teams and the ability to influence senior business leaders and customers.
• Knowledge of advanced packaging technologies, AI/HPC market trends, and non-standard substrate manufacturing challenges.
• Proven ability to lead complex cross-business-unit initiatives from concept through customer adoption without direct authority.

Culture & Benefits

• Supportive environment focused on learning, professional development, and career growth.
• Health and wellbeing programs and comprehensive employee benefits.
• Opportunity to work on semiconductor technologies supporting AI and next-generation advanced packaging.
• Regular collaboration with internal organizations, external vendors, ecosystem partners, and leading-edge customers.