Tech Proj/Prog Manager IV (Advanced Packaging)

Location: Santa Clara, California, United States

Salary: $133,500–$183,500 per year

Company

hirify.global develops and services materials engineering equipment used to manufacture semiconductors and advanced displays.

What you will do

• Own the Special Substrate Handling product vision, strategy, roadmap, and business case across business units.
• Drive system-level requirements alignment among platform, engineering, business-unit, customer, and partner organizations.
• Translate customer challenges and advanced packaging trends into prioritized product and platform requirements.
• Lead cross-functional roadmap planning across hardware, software, automation, robotics, metrology, and subsystem teams.
• Act as system integration leader for SSH capabilities across multiple product platforms.
• Develop governance, program management processes, market assessments, and growth strategies for advanced packaging and AI-driven manufacturing.

Requirements

• 10+ years of experience in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development.
• Deep experience in semiconductor equipment, automation, robotics, substrate handling, or system integration.
• Ability to operate as a product manager, systems architect, and program manager.
• Strong technical credibility with engineering teams and ability to influence business leaders and customers without direct authority.
• Understanding of advanced packaging technologies, AI/HPC market trends, and non-standard substrate manufacturing challenges.
• Relocation is not eligible for this role.

Culture & Benefits

• Full-time regular employment.
• Supportive environment focused on learning, professional development, and innovation.
• Comprehensive benefits supporting employee health and wellbeing.
• Travel required approximately 10% of the time.
• Additional compensation may include a bonus and stock award program, where applicable.