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23 часа назад

Senior Process Development Engineer (Semiconductor Thin Films)

113 000 - 145 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Process Development Engineer (Semiconductor Thin Films): Leading process and application development for ion beam deposition and etch technologies, including advanced thin film process design, experimentation, data analysis, and hardware upgrades with an accent on semiconductor manufacturing and customer requirements. Focus on developing best known methods, characterizing thin films with advanced techniques, integrating processes for logic and memory fabrication, and supporting technical partnerships with customers.

Location: US - NY - Plainview; travel up to 30% domestically and internationally

Salary: $113,000–$145,000 per year plus bonus opportunity

Company

hirify.global designs, develops, manufactures, and services complex machines used to create semiconductor and other advanced technology devices.

What you will do

  • Lead process and application development using ion beam deposition and etch technologies.
  • Develop advanced thin film processes based on current and future customer requirements.
  • Design experiments, execute process studies, and analyze results.
  • Develop and maintain best known methods for process control, development, and continuous improvement.
  • Serve as a technical expert for customers and support Sales and Marketing in establishing technical partnerships.
  • Define process specifications and develop hardware upgrades with Engineering.

Requirements

  • At least 6 years of experience and a Master’s degree, or a PhD with at least 3 years of experience, in Physics, Materials Science, or a related field.
  • Process development experience and expertise in vacuum thin film technology.
  • Expertise in semiconductor thin film technologies.
  • Knowledge of semiconductor devices, module processes, and process integration in logic and/or memory fabrication.
  • Experience with thin film characterization techniques including four-point probe, stress measurements, ellipsometry, spectroscopy, XRD/XRR, and depth profiling.
  • Ability to analyze characterization data from TEM, EBSD, EELS, and XPS.

Nice to have

  • Experience with metallic thin films.

Culture & Benefits

  • Medical, dental, and vision insurance.
  • 401(k) with company match and employee stock purchase plan.
  • Holiday, vacation, and sick time.
  • Flexible spending accounts and commuter benefits.
  • Tuition reimbursement, life and disability insurance, and employee assistance program.

Hiring process

  • Multiple interviews with several team members, conducted in person or virtually.
  • References or a background investigation may be conducted before an offer.

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