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2 дня назад

Thin Films Module Development Engineering (Semiconductor Manufacturing)

133 800 - 255 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

Текст:
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TL;DR
Thin Films Module Development Engineering (Semiconductor Manufacturing): Developing and optimizing advanced thin-film manufacturing processes for semiconductor packaging and next-generation device architectures with an accent on process integration, equipment solutions, and high-volume manufacturing. Focus on feasibility studies, technology roadmaps, statistical process control, and solving complex scalability and process-stability challenges.

Location: On-site in Hillsboro, Oregon, United States

Salary: $133,800–$255,200 USD annually

Company

hirify.global develops semiconductor technologies and advanced packaging solutions for high-volume manufacturing.

What you will do

  • Design and develop advanced manufacturing processes, including material selection, parameter optimization, metrology, and system design.
  • Enable technologies for high-volume manufacturing and future semiconductor products.
  • Conduct feasibility studies and simulations to meet device specifications.
  • Create technology roadmaps and lead programs from development through production enablement.
  • Collaborate with equipment and material suppliers and cross-functional teams on process integration and deliverables.
  • Improve production efficiency, process stability, equipment scalability, and manufacturing output using statistical process control and data analytics.

Requirements

  • Bachelor’s degree in a relevant STEM discipline with 5+ years of relevant experience, or a master’s degree with 3+ years, or a PhD with 1+ years.
  • Experience in manufacturing process development, statistical process control, and/or data analytics.
  • Experience with wafer-level assembly, semiconductor processing, or advanced packaging technology development.
  • Experience with thin-film processing techniques, including CVD, PECVD, thermal or plasma-enhanced ALD, and PVD.
  • Ability to work on-site in Hillsboro, Oregon, United States.

Nice to have

  • Experience with hybrid bonded interconnects or related advanced packaging technologies.
  • Technical leadership in solving complex engineering challenges.
  • Experience leading programs from strategy formation to high-volume production.
  • Strong collaboration with yield, operations, and supplier-management functions.

Culture & Benefits

  • Work in an advanced packaging technology development organization focused on future semiconductor manufacturing.
  • Competitive compensation with stock bonuses.
  • Health, retirement, and vacation benefits.
  • Shift 1 schedule in the United States.

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