2 дня назад
Thin Films Module Development Engineering (Semiconductor Manufacturing)
133 800 - 255 200$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Thin Films Module Development Engineering (Semiconductor Manufacturing): Developing and optimizing advanced thin-film manufacturing processes for semiconductor packaging and next-generation device architectures with an accent on process integration, equipment solutions, and high-volume manufacturing. Focus on feasibility studies, technology roadmaps, statistical process control, and solving complex scalability and process-stability challenges.
Location: On-site in Hillsboro, Oregon, United States
Salary: $133,800–$255,200 USD annually
Company
develops semiconductor technologies and advanced packaging solutions for high-volume manufacturing.
What you will do
- Design and develop advanced manufacturing processes, including material selection, parameter optimization, metrology, and system design.
- Enable technologies for high-volume manufacturing and future semiconductor products.
- Conduct feasibility studies and simulations to meet device specifications.
- Create technology roadmaps and lead programs from development through production enablement.
- Collaborate with equipment and material suppliers and cross-functional teams on process integration and deliverables.
- Improve production efficiency, process stability, equipment scalability, and manufacturing output using statistical process control and data analytics.
Requirements
- Bachelor’s degree in a relevant STEM discipline with 5+ years of relevant experience, or a master’s degree with 3+ years, or a PhD with 1+ years.
- Experience in manufacturing process development, statistical process control, and/or data analytics.
- Experience with wafer-level assembly, semiconductor processing, or advanced packaging technology development.
- Experience with thin-film processing techniques, including CVD, PECVD, thermal or plasma-enhanced ALD, and PVD.
- Ability to work on-site in Hillsboro, Oregon, United States.
Nice to have
- Experience with hybrid bonded interconnects or related advanced packaging technologies.
- Technical leadership in solving complex engineering challenges.
- Experience leading programs from strategy formation to high-volume production.
- Strong collaboration with yield, operations, and supplier-management functions.
Culture & Benefits
- Work in an advanced packaging technology development organization focused on future semiconductor manufacturing.
- Competitive compensation with stock bonuses.
- Health, retirement, and vacation benefits.
- Shift 1 schedule in the United States.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
2 дня назад
Process Development Engineer (Spector)
93 000 - 118 000$
2 дня назад
Sr. Principal Product Engineer (Semiconductor)
156 820 - 234 900$
5 дней назад
Physical Design Engineer (2.5D/3D IC)
143 800 - 230 000$
9 часов назад
Senior Staff Engineer Digital IC Build Flow and Methodology (Semiconductors)
151 000 - 223 440$
9 часов назад
Senior Staff Physical Verification CAD Engineer (Semiconductor)
127 630 - 191 200$
2 дня назад
Principal Engineer (Advanced Packaging)
168 400 - 249 310$