lean six sigmatechnology transferroot cause analysisyield improvementmoldingsemiconductor manufacturingplatingwire bonding
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата не указанаПонятные задачиКрупный производительВысокий порог входа
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Mid End Process Manager (Semiconductor): Leading sustaining engineering across wire bond, molding, plating, singulation, and trim & form processes in a semiconductor assembly manufacturing environment with an accent on process stability, yield improvement, and defect reduction. Focus on resolving complex manufacturing issues, managing process qualifications and technology transfers, and developing engineering teams.
Location: Seremban, Malaysia
Company
hirify.global develops and manufactures semiconductor products and operates semiconductor assembly manufacturing environments.
What you will do
Lead and develop sustaining engineering teams supporting wire bond, molding, plating, singulation, and trim & form processes.
Drive process stability, robustness, yield improvement, defect reduction, cost reduction, productivity, equipment utilization, and cycle time optimization.
Resolve complex manufacturing issues using root cause analysis, 8D, 5 Why, FMEA, DOE, and statistical analysis.
Manage process qualifications, technology transfers, package conversions, and new product introduction activities.
Collaborate with Production, Quality, Equipment Engineering, Maintenance, Product Engineering, and customers on technical challenges and manufacturing performance.
Monitor process metrics, support customer audits and reliability investigations, and provide technical guidance and career development to engineers and technicians.
Requirements
Strong technical expertise in wire bond, molding, plating, singulation, and trim & form semiconductor processes.
Proven experience improving yield and reducing defects in semiconductor manufacturing.
Experience with 8D, 5 Why, FMEA, DOE, SPC, root cause analysis, and structured problem-solving.
Experience leading and developing process engineering and technician teams, including 5+ years of leadership experience.
Experience with package qualifications, technology transfer projects, and NPI activities.
Bachelor’s degree in Mechanical, Electrical, Mechatronics, or an equivalent field, with 10+ years of semiconductor equipment experience.
Nice to have
Lean Six Sigma knowledge.
TPM knowledge.
Culture & Benefits
Inclusive and accessible recruitment process with fair consideration for applicants.
Safe work environment and reasonable adjustments where requested.
Employee resource groups, including the Pride Network Group and global and local Women’s groups.
Commitment to increasing women in management positions to 30% by 2030.
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