data visualizationprogram managementtechnology transfernew product introductionadvanced packaginghigh volume manufacturingsemiconductor manufacturingassembly test manufacturingfactory qualification
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Company hidden предлагает четко очерченную старшую роль в полупроводниковом производстве с серьезной ответственностью за запуск продукта, но зарплата не указана, поэтому ее сложно сравнить с рыночным ориентиром.
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Зарплата не указанаПонятная зона ответственностиКрупный производительРабота на площадке
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Текст:
Hirify AI/Оригинал
TL;DR
Senior NPI Engineer (Semiconductor Manufacturing): Leading end-to-end new product introduction launches from technology transfer and factory qualification through high-volume manufacturing with an accent on advanced packaging, assembly-test operations, and cross-functional program governance. Focus on planning sample builds, validating equipment capability and process repeatability, mitigating launch risks, and transferring products into sustained high-volume production.
Location: On-site in Penang or Kulim, Malaysia
Company
hirify.global develops and manufactures semiconductor and high-tech electronics products.
What you will do
Lead end-to-end new product introduction launches from initial planning and technology transfer through high-volume manufacturing.
Define technology-transfer milestones and factory start-up readiness requirements.
Coordinate system, process, and material readiness, including factory qualification and certification activities.
Plan technical programs, lead project teams, track schedules, and drive risk mitigation.
Own sample build plans and coordinate product and package start-ups with local teams, Technology Development, divisions, and Virtual Factory partners.
Track equipment capability, line yield, and process repeatability, then use post-ramp reviews to improve factory NPI deployment speed.
Requirements
Bachelor's degree in science or a related engineering field such as electrical, electronic, electro-mechanical, chemical, or manufacturing engineering.
8+ years of direct experience in new product introduction, advanced packaging, semiconductor assembly and test, or high-tech electronics manufacturing.
Hands-on experience with Assembly Test Manufacturing operations, including factory start-up, technology transfer, qualification, ramp, and high-volume manufacturing.
Knowledge of Assembly Test Manufacturing setups and end-to-end manufacturing flows.
Data-driven approach, structured problem-solving skills, and proficiency in data mining and visualization.
Strong communication, leadership, and stakeholder management skills in a matrixed environment.
Nice to have
Experience in module integration.
Culture & Benefits
Full-time experienced-hire position.
Shift 1 schedule in Malaysia.
On-site work model.
Employment practices follow local equal-opportunity and ethical hiring requirements.
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