Equipment Engineer

Тип работы

fulltime

Английский

Страна

Malaysia

Вакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:

TL;DR

Equipment Engineer (Semiconductor Packing): Developing and implementing packing materials, packing methods, and quality processes for semiconductor manufacturing with an accent on material standardization, qualification, and supplier coordination. Focus on leading packing-related NPI, updating SOPs, FMEAs, control plans, and APL system data, and resolving daily supplier quality issues.

Location: Kuala Lumpur, Malaysia

Company

hirify.global is a semiconductor company with operations in Malaysia.

What you will do

Coordinate ATKL packing materials and drive packing cost implementation, material standardization, and packing quality.
Collaborate with equipment, manufacturing, and supplier teams to improve packing quality.
Lead packing-related TBE NPI activities and ensure timely execution.
Develop and update SOPs, SWEs, OCAPs, FMEAs, and control plans for packing processes.
Qualify trays, carrier tape, cover tape, desiccants, HICs, boxes, and bubble wrap.
Maintain packing methods and material submissions across APL, Enovia, Beeline, GMDM, and MMPR systems.

Requirements

Engineering degree in Electronics, Mechanical, Mechatronics, or Chemical Engineering.
Preferred experience in semiconductor manufacturing and vision inspection.
Ability to work in a fast-paced manufacturing environment while managing multiple priorities.
Strong ownership, teamwork, communication, and problem-solving skills.
Programming language knowledge is an advantage.

Culture & Benefits

Full-time position.
Work closely with equipment, manufacturing, and external supplier teams.
Role includes responsibility for daily supplier-related packing issues and quality coordination.

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