Signal Integrity / Power Integrity Intern

Location: On-site in San Jose, California, United States

Company

hirify.global co-designs AI accelerator chips, racks, software, and manufacturing systems focused on high-throughput, low-latency inference.

What you will do

• Analyze signal integrity for PCIe, Ethernet, and other high-speed SerDes links.
• Extract and validate S-parameter models from package and PCB layouts, including insertion loss, return loss, impedance discontinuities, and crosstalk.
• Build and validate 3D electromagnetic models in Ansys HFSS and develop board and package channel models from ECAD databases.
• Correlate simulation results with measurements and laboratory data.
• Collaborate with PCB layout, package, hardware, and ASIC engineers to identify root causes and improve channel performance.
• Develop SI design guidelines and automate simulation and compliance-reporting workflows.

Requirements

• Progress toward a BS, MS, or PhD in Electrical Engineering, Computer Engineering, or a related field.
• Coursework or project experience in signal integrity, electromagnetics, RF, microwave engineering, or high-speed digital design.
• Understanding of transmission line theory, S-parameters, PCB stackups, routing, and high-speed design fundamentals.
• Strong analytical, debugging, communication, and collaboration skills.
• Ability to work on-site at the San Jose office.

Nice to have

• Experience with Ansys HFSS, SIwave, ADS, CST, or similar simulation tools.
• Experience with PCIe, Ethernet, DDR, or other high-speed interfaces.
• Familiarity with Allegro, APD, ODB++, IPC2581, Touchstone files, or channel metrics.
• Python scripting for simulation automation and data analysis.
• Laboratory measurement experience with VNAs, oscilloscopes, or TDR equipment.

Culture & Benefits

• 12-week paid internship.
• Housing support for candidates relocating.
• Daily lunch and dinner provided at the office.
• Direct mentorship from experienced engineers and technical leaders.
• Fully in-person work in San Jose with opportunities to collaborate across engineering and research disciplines.