DMTS SiPh Packaging & Assembly Materials (SiPh)

Location: USA - Vermont - Essex Junction

Salary: $166,300.00–$291,200.00 per year

Company

hirify.global is a semiconductor foundry providing design, development, fabrication, advanced packaging, and photonics services for technology companies.

What you will do

• Drive the growth of silicon photonics packaging into fully packaged electro-optical transceiver products using 2.5D and 3D co-packaged optics.
• Define package architectures, materials selection criteria, design rules, and electrical, photonic, and thermal stress plans for chiplet and module qualification.
• Lead reliability, failure analysis, FMEA, quality, and qualification activities for photonic and electronic packages.
• Develop and standardize measurement methodologies for modules supporting data transfer rates above 6.4 Tbps.
• Advance fiber-attach, photonic interconnect, copper interconnect, and hybrid-bonding solutions with internal teams and OSAT partners.
• Provide technical leadership, training, customer enablement, and subject-matter expertise across silicon photonics packaging.

Requirements

• MS or PhD with 20 or more years of experience.
• Expertise in photonic and electronic package architecture definition.
• Experience bringing packaged products from development into production for data center, automotive, and communications applications.
• Expert knowledge of chip-package interaction for 2D, 2.5D, and 3D silicon photonics advanced packaging.
• Broad knowledge of technology, design, manufacturing, and commercial trends.

Nice to have

• Leadership contributions to national or international science, technology, or manufacturing R&D agendas.
• Participation in industry standards boards.
• Background in materials science, thermal and mechanical engineering, or simulation.
• Experience with failure analysis, design of experiments, and packaging process integration.

Culture & Benefits

• Full-time employment in an advanced semiconductor manufacturing environment.
• Work supporting applications in data centers, automotive, communications, AI, and high-performance computing.
• Commitment to equal opportunity, workplace diversity, and employee safety.
• Reasonable accommodation is available during the employment process.