Semiconductor Packaging Engineer (Semiconductor)

Location: Tianjin (Xinghua), China; international travel to package assembly sites and suppliers may be required.

Company

hirify.global develops semiconductor solutions and packaging technologies for global markets.

What you will do

• Translate semiconductor market requirements into packaging solutions and lead package product, structure, and assembly process development.
• Resolve materials and processing issues during product and technology development.
• Work with Design, Materials, Modeling, and Package Processing teams to develop package innovation solutions.
• Collaborate with internal assembly sites and OSATs to qualify package solutions for manufacturing.
• Evaluate emerging packaging and assembly technologies and implement suitable solutions in production.
• Contribute to technical publications, conferences, and patent applications.

Requirements

• M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering.
• Knowledge of semiconductor packaging development, assembly processes, and materials-related problem solving.
• Experience or familiarity with industry-standard project management tools.
• Strong written, verbal, communication, and presentation skills.
• Self-driven, adaptable, collaborative, and able to work effectively with engineering and management teams.

Nice to have

• Knowledge of IC packages including QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, and FOWLP.
• Knowledge of statistical analysis and Design of Experiment.

Culture & Benefits

• Full-time employment in a dynamic, fast-paced engineering environment.
• Collaboration with global and local teams across NXP engineering, assembly, and supplier organizations.
• Potential international travel to package assembly sites and suppliers.