Senior Package Architect (Semiconductor)

Location: Cabuyao, Philippines; onsite

Company

hirify.global develops semiconductor technologies and package solutions for power applications.

What you will do

• Develop, qualify, and introduce semiconductor package technologies, processes, and materials for power package applications.
• Lead package and process integration activities with internal manufacturing sites, subcontractors, cross-functional teams, and business groups.
• Evaluate subcontractors through technical assessments, RFQs, benchmarking, and capability reviews.
• Review Design of Experiments, engineering evaluations, qualification plans, process assessments, and process freeze activities.
• Drive failure analysis investigations and corrective actions for reliability and quality issues.
• Prepare technical reports and documentation, support technology roadmaps, and contribute to invention disclosures and patent applications.

Requirements

• Bachelor’s degree in Electronics, Mechanical, Materials, Manufacturing, or related engineering discipline.
• Strong knowledge of semiconductor assembly processes, including die attach, clip attach, wire bond, molding, trim and form, and singulation.
• Understanding of semiconductor packaging materials and manufacturing technologies.
• Hands-on experience with SPC, DOE, MSA/GRR, 8D problem solving, root cause analysis, DFMEA/PFMEA, and control plans.
• Experience with statistical analysis software such as JMP, Minitab, or Statistica.
• Strong analytical, communication, presentation, leadership, and cross-functional collaboration skills.

Nice to have

• Experience working with semiconductor manufacturing subcontractors.
• Knowledge of final test processes.

Culture & Benefits

• Competitive salary and benefits package.
• Professional development and growth opportunities.
• Commitment to workplace safety, employee well-being, diversity, and inclusion.
• Innovative and dynamic work environment.
• Employee resource groups, including Pride Network and women’s groups.