Packaging Research and Development Engineer (Semiconductor Packaging)

Location: On-site in Phoenix, Arizona, United States

Salary: $115,110–$219,550 USD annual salary

Company

hirify.global is a semiconductor technology company developing and manufacturing advanced computing and packaging solutions.

What you will do

• Define equipment configurations, process specifications, and integrated process flows for new substrate packaging technologies.
• Plan and conduct design-of-experiments to characterize process windows and interactions among processes, equipment, and materials.
• Drive improvements in process capability, stability, quality, reliability, cost, yield, automation, and productivity.
• Develop advanced substrate packaging technology supporting die disaggregation and heterogeneous integration.
• Work with equipment and materials suppliers and spend most of the time on the factory floor.
• Lead and participate in cross-functional and cross-organizational technology development teams.

Requirements

• Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related field plus 5+ years of experience; or a master’s degree plus 3+ years; or a PhD plus 1+ years.
• Experience in semiconductor manufacturing, semiconductor technology development, or materials development.
• Strong engineering troubleshooting, analytical, communication, and teamwork skills.
• Experience working with process tools, equipment troubleshooting, statistical process control, process development, and design of experiments.
• Willingness to travel occasionally, with travel expected to be less than 5%.
• Flexibility to work with ambiguity and variable job roles and working hours.

Nice to have

• Experience with organic and inorganic materials, process characterization, and analytical techniques such as DSC, TGA, D/TMA, FTIR, XPS, SEM, and EDX.
• Experience with JMP, JSL, Python, relational databases, statistical data analysis, or machine learning.
• Experience collaborating with process and integration engineers on integrated technology issues.

Culture & Benefits

• On-site work in a semiconductor packaging manufacturing facility.
• Competitive pay with potential stock bonuses.
• Health, retirement, and vacation benefits.
• Work in a cross-functional environment focused on advanced packaging innovation.