Physical Design Engineer (2.5D/3D IC)

TL;DR

Physical Design Engineer (2.5D/3D IC): Developing and implementing physical layouts for advanced ASIC products with an accent on power grids, die-to-die interconnects, signal integrity, and advanced packaging. Focus on automating layout processes, optimizing ubump and RDL patterns, and evaluating new 2.5D and 3D interconnect technologies for high-speed systems.

Location: Onsite in San Jose, California, USA

Annual base salary: USD 143,800–230,000, plus a discretionary annual bonus and potential equity awards.

Company

hirify.global develops advanced semiconductor and ASIC technologies for machine learning, cloud computing, wireless infrastructure, networking, and 2.5D/3D interconnect applications.

What you will do

• Implement physical layouts for power grids and 2.5D/3D die-to-die interconnects.
• Perform DRC, LVS, and electrical checks across IC, package, and PCB designs.
• Develop high-speed signal interconnects in collaboration with signal integrity and power integrity engineers.
• Analyze and optimize ubump and RDL patterns.
• Automate recurring design processes and layout steps using scripting.
• Evaluate new interconnect technologies and contribute to advanced-packaging technology and test-chip roadmaps.

Requirements

• Bachelor's degree in Electrical Engineering or Computer Science with 12+ years of related experience, or a master's degree with 10+ years of related experience.
• Experience with IC, package, and PCB layout databases and tools.
• Strong TCL and Python scripting skills for process automation.
• Electrical engineering background and experience with physical layout implementation.
• Ability to manage multiple customer projects under short timelines and work independently with incomplete information.
• Ability to collaborate across a worldwide organization and customer base.

Culture & Benefits

• Work alongside R&D, IP development, customers, and manufacturing partners.
• Medical, dental, and vision insurance plans.
• 401(k) participation with company matching and an Employee Stock Purchase Program.
• Company-paid holidays, paid sick leave, vacation time, and applicable family and other leave programs.
• Discretionary annual bonus, new-hire equity grants, and potential annual equity awards.