Назад
Company hidden
1 день назад

Principal Physical Design Engineer (SoC)

174 000 - 352 500$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/

TL;DR

Principal Physical Design Engineer (SoC): Implementing large SoC chip-level physical design from RTL to GDSII with an accent on IP integration, floorplanning, and clock network development. Focus on optimizing timing, power constraints, and ensuring successful sign-off for 7nm and below processes.

Location: Hybrid (expectation to work on average 2 days per week from an HPE office in California, USA)

Salary: $174,000 - $352,500 per year

Company

hirify.global is a global edge-to-cloud company advancing the way people live and work by helping companies connect and analyze their data.

What you will do

  • Implement large SoC physical design from RTL to GDSII, creating manufacturing-ready design databases.
  • Integrate blocks and IPs from vendors, collaborating with packaging teams on bump and pad placement.
  • Build full-chip floorplans, including power grids, RDL design, and block optimization.
  • Develop chip-level clock networks and manage timing budgets across blocks and sub-chips.
  • Perform block-level place and route and implement ECOs to fix timing and signal integrity violations.
  • Execute physical design verification (LVS/DRC/ERC/ANT) and integrate DFT into the design flow.

Requirements

  • BS in Electrical/Computer Engineering with 7+ years of experience, or MS with 5+ years.
  • Deep expertise in large SoC designs, floor-planning, place & route, and CTS.
  • Experience developing chip-level power-grids and clock networks.
  • Proficiency in Verilog, Linux shell scripts, Python, TCL, and Perl.
  • Proven track record of successful chip tapeouts at 7nm and below.
  • Must be based in or able to work from an HPE office in California, USA (Hybrid).

Nice to have

  • Exposure to 2.5D/3D packaging.
  • Experience with high-performance and large chip designs.
  • Exposure to DFT.

Culture & Benefits

  • Comprehensive suite of health, financial, and emotional wellbeing benefits.
  • Specific career development programs for knowledge experts and cross-divisional growth.
  • Unconditionally inclusive environment that values varied backgrounds.
  • Flexibility to manage work and personal needs.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →