Mechanical Engineer (HPC Hardware)

TL;DR

Mechanical Engineer (HPC Hardware): Designing high-performance interconnect hardware, including PCIe adapters, networking switches, and complex electronic assemblies, with an accent on mechanical architecture, manufacturability, and rack-level integration. Focus on driving products from architecture and validation through tooling and mass production, solving tolerance, reliability, thermal, and manufacturing challenges.

Location: Hybrid at the headquarters in Wayne, Pennsylvania, with some remote work possible; residence within commuting distance is required.

Company

hirify.global develops purpose-built interconnect solutions for high-performance computing, scientific, commercial, and government applications.

What you will do

• Lead mechanical architecture and design for PCIe adapters, networking switches, and electronic assemblies.
• Drive products through the complete NPI lifecycle, from EVT/DVT validation to tooling release and high-volume production.
• Optimize designs for die casting, sheet metal fabrication, extrusion, cost, reliability, and mass production.
• Create and manage 3D models, 2D drawings, and BOMs using Creo, Windchill, or comparable CAD/PLM tools.
• Collaborate with thermal, electrical, regulatory, and manufacturing teams on mechanical, structural, and thermal trade-offs.
• Lead prototyping, tolerance analysis, laboratory qualification testing, and resolution of manufacturing issues.

Requirements

• BS in Mechanical Engineering or a closely related field.
• 5+ years of experience designing electronics packaging, adapters, or networking hardware.
• Strong knowledge of PCIe, OCP 3.0, EIA-310, and rack-level mechanical integration.
• Expertise in die casting, sheet metal fabrication, extrusion, and other volume manufacturing processes.
• Experience managing global contract manufacturers or ODMs, tooling kickoffs, and factory escalations during production ramp-up.
• Proficiency with MCAD and PLM tools, with Creo and Windchill strongly preferred, plus experience with RCA and tolerance stack-up analysis.

Nice to have

• Experience with HPC or data center hardware.
• Knowledge of large-scale heat sinks, TIMs, and direct liquid cooling architectures.

Culture & Benefits

• Cross-functional collaboration across mechanical, thermal, electrical, regulatory, and manufacturing disciplines.
• Hands-on work involving physical prototyping, lab testing, and production hardware.
• Equal opportunity employment regardless of legally protected characteristics.