Mechanical Design Engineer (Semiconductors)

TL;DR

Mechanical Design Engineer (Semiconductors): Designing and developing mechanical components and tooling for semiconductor packaging and assembly with an accent on substrates, integrated heat spreaders, and process media trays. Focus on optimizing manufacturability, creating detailed technical drawings, and solving complex design problems in high-precision environments.

Location: Phoenix, Arizona, US (On-site presence required)

Salary: $105,650 - $149,150 USD

Company

A global leader in semiconductor manufacturing and innovation.

What you will do

• Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
• Develop and maintain mechanical designs and detailed drawings for substrates, Integrated Heat Spreaders (IHS), and stiffeners.
• Create designs for process media trays used during various assembly stages.
• Collaborate with architecture, process, and assembly teams to ensure design intent and manufacturability.
• Serve as the primary point of contact for all packaging mechanical design collateral.
• Proactively identify and resolve design and process issues to ensure timely project execution.

Requirements

• Bachelor's degree in mechanical engineering or a STEM related field.
• 1+ year of experience with 2D and 3D CAD software.
• Strong foundation in mechanical design and 3D spatial awareness.
• Ability to interpret and generate technical drawings and specifications.
• Must be authorized to work in the US; this position is not eligible for immigration sponsorship.

Nice to have

• Master's degree in mechanical engineering or a STEM related field.
• 2+ years of experience with SolidWorks, Siemens NX, and AutoCAD.
• Experience in semiconductor packaging or high-precision manufacturing environments.
• Familiarity with material properties and mechanical tolerances used in package design.

Culture & Benefits

• Competitive salary and stock bonuses.
• Comprehensive health and retirement benefit programs.
• Paid vacation and industry-leading total compensation package.