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6 часов назад

Senior NPI Engineer (Hardware)

115 000 - 184 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Senior NPI Engineer (Hardware): Shepherding hardware from concept review to high-volume manufacturing for self-driving lidar systems with an accent on optical alignment and assembly process readiness. Focus on yield analysis, implementing DfX principles, and managing technical transitions to contract manufacturers (CM).

Location: Hybrid (must be in office at least 3 days per week in the US)

Salary: $115,000 - $184,000 per year

Company

hirify.global is developing the hirify.global Driver to create a safer, more efficient, and more accessible transportation ecosystem using self-driving technology.

What you will do

  • Lead the transition of critical micro-optical alignment and lidar system assembly from engineering to high-volume manufacturing.
  • Monitor yield analysis and drive continuous improvement initiatives to achieve capacity and cost targets.
  • Provide onsite engineering support for technical ownership of process and equipment issues.
  • Develop and maintain critical manufacturing documentation including BOMs, SOPs, PFMEAs, and control plans.
  • Execute multidisciplinary problem-solving using DfX (DfM, DfA, DfC, DfI/T, DfS/R/M) to optimize production.
  • Coordinate with internal design teams and external CMs to ensure end-to-end assembly readiness.

Requirements

  • Minimum of 8 years of engineering experience in low to high-volume production environments.
  • Expertise in optical alignment process development, optical interconnects, and chip-to-chip coupling.
  • Proficiency in SPC, 6 sigma, quality control processes, and GD&T.
  • Experience with 3D CAD and PDM/PLM tools, specifically Catia/Solidworks and Enovia/EPDM.
  • Must be able to work in a hybrid environment (in-office 3+ days per week).
  • Ability to travel internationally 20-35% and conduct evening calls with partners in Asia.

Nice to have

  • Experience in the automotive or robotics industry.
  • Knowledge of Flip Chip Packaging, multi-chip modules, and hybrid bonding.
  • Experience working with OSAT in a volume manufacturing environment.
  • Background in the semiconductor or optical communication industry.

Culture & Benefits

  • Competitive base salary with annual bonus and equity compensation.
  • Collaborative hybrid work environment emphasizing empathy and leadership.
  • Strong organizational commitment to safety and inclusive hiring practices.
  • Opportunity to solve massively complex problems in the field of autonomous mobility.

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