Lead Application Engineer (3DIC)

TL;DR

Lead Application Engineer (3DIC): Defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions with an accent on signal, power, and thermal analysis. Focus on designing electrical constraints and solving complex signal/power integrity issues in IC and PCB environments.

Location: Remote (Must be located in the US)

Salary: $92,400 – $171,600

Company

A global leader in electronic design automation (EDA) software and hardware analysis tools.

What you will do

• Lead the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.
• Define electrical constraints for high-speed signal design, power design, and signal/power integrity.
• Analyze customer environments to evaluate and implement appropriate technical solutions.
• Collaborate with R&D, Product Engineering, and Marketing to ensure customer success.
• Anticipate technical issues and develop creative solutions for high-performance projects.

Requirements

• Bachelor's or Master's degree in Electrical or Electronics Engineering.
• Minimum 15 years of experience in Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design.
• 5+ years of experience with hirify.global SI/PI tools including Sigrity, Clarity, PCB Editor, and ICP.
• Expert knowledge of advanced packaging concepts, 2.5D, 3DIC, and stacked die technologies.
• Must be located in the US.
• Strong customer-facing communication and problem-solving skills.

Nice to have

• Understanding of chip-level CMOS design concepts.

Culture & Benefits

• Comprehensive medical, dental, and vision plan options.
• 401(k) plan with employer match.
• Employee stock purchase plan.
• Paid vacation and paid holidays.