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7 часов Π½Π°Π·Π°Π΄

Senior PCB Designer (Mixed-Signal)

Π€ΠΎΡ€ΠΌΠ°Ρ‚ Ρ€Π°Π±ΠΎΡ‚Ρ‹
hybrid
Π’ΠΈΠΏ Ρ€Π°Π±ΠΎΡ‚Ρ‹
fulltime
Π“Ρ€Π΅ΠΉΠ΄
senior
Английский
b2
Π‘Ρ‚Ρ€Π°Π½Π°
US
РСлокация
US
Вакансия ΠΈΠ· списка Hirify.GlobalВакансия ΠΈΠ· Hirify Global, списка ΠΌΠ΅ΠΆΠ΄ΡƒΠ½Π°Ρ€ΠΎΠ΄Π½Ρ‹Ρ… tech-ΠΊΠΎΠΌΠΏΠ°Π½ΠΈΠΉ
Для мэтча ΠΈ ΠΎΡ‚ΠΊΠ»ΠΈΠΊΠ° Π½ΡƒΠΆΠ΅Π½ Plus

ΠœΡΡ‚Ρ‡ & Π‘ΠΎΠΏΡ€ΠΎΠ²ΠΎΠ΄

Для мэтча с этой вакансиСй Π½ΡƒΠΆΠ΅Π½ Plus

ОписаниС вакансии

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TL;DR

Senior PCB Designer (Mixed-Signal): Designing complex, multi-layer high-density interconnect PCBs for Applications, Validation, and ATE requirements with an accent on signal-integrity, high-speed routing, and manufacturability. Focus on translating schematics into robust layouts at sub 0.4 mm pitch and optimizing power-integrity for cutting-edge mixed-signal processing products.

Location: Hybrid in Austin, Texas. Candidates must live within a commutable distance or be willing to relocate to the US.

Company

hirify.global is a leader in mixed-signal processing, creating innovative end-user solutions for the world's top consumer brands.

What you will do

  • Design complex, multi-layer, high-density interconnect (HDI) PCBs from schematic capture through manufacturing release.
  • Translate schematics and signal-integrity constraints into manufacturable board layouts at sub 0.4 mm pitch.
  • Implement high-speed design practices, including impedance-controlled routing, differential pair tuning, and power-integrity optimization.
  • Collaborate with IC design, packaging, hardware, and mechanical teams to ensure seamless product stack integration.
  • Ensure compliance with DFM, DFF, DFT, and IPC industry standards.
  • Oversee the generation of fabrication and assembly documentation, including Gerbers, ODB++, and build notes.

Requirements

  • 2-year technical degree or equivalent with demonstrable experience in PCB layout.
  • 5+ years of experience with ECAD tools such as Cadence Allegro, Altium Designer, or Siemens/Mentor Graphics.
  • Thorough understanding of mixed-signal, HDI, complex via stack-ups, and WLCSP design principles.
  • In-depth knowledge of IPC standards and design for manufacturing (DFM) guidelines.
  • Must be authorized to work for any employer in the U.S. without sponsorship.
  • Must be able to access technical data without a requirement for an export license.

Nice to have

  • Experience using AI tools to enable design efficiency.
  • CID and CID+ certification.
  • Knowledge of ATE (HIBs, PIBs, Probe Cards) and semiconductor reliability stress (HAST/HTOL) hardware.

Culture & Benefits

  • Award-winning culture built on inclusion, fairness, and meaningful community engagement.
  • Hybrid work arrangement (2 days in the office) with flexibility to work from home based on business needs.
  • Exceptional benefits package.
  • Opportunity to work on cutting-edge technology for top global consumer brands.

Π‘ΡƒΠ΄ΡŒΡ‚Π΅ остороТны: Ссли Ρ€Π°Π±ΠΎΡ‚ΠΎΠ΄Π°Ρ‚Π΅Π»ΡŒ просит Π²ΠΎΠΉΡ‚ΠΈ Π² ΠΈΡ… систСму, ΠΈΡΠΏΠΎΠ»ΡŒΠ·ΡƒΡ iCloud/Google, ΠΏΡ€ΠΈΡΠ»Π°Ρ‚ΡŒ ΠΊΠΎΠ΄/ΠΏΠ°Ρ€ΠΎΠ»ΡŒ, Π·Π°ΠΏΡƒΡΡ‚ΠΈΡ‚ΡŒ ΠΊΠΎΠ΄/ПО, Π½Π΅ Π΄Π΅Π»Π°ΠΉΡ‚Π΅ этого - это мошСнники. ΠžΠ±ΡΠ·Π°Ρ‚Π΅Π»ΡŒΠ½ΠΎ ΠΆΠΌΠΈΡ‚Π΅ "ΠŸΠΎΠΆΠ°Π»ΠΎΠ²Π°Ρ‚ΡŒΡΡ" ΠΈΠ»ΠΈ ΠΏΠΈΡˆΠΈΡ‚Π΅ Π² ΠΏΠΎΠ΄Π΄Π΅Ρ€ΠΆΠΊΡƒ. ΠŸΠΎΠ΄Ρ€ΠΎΠ±Π½Π΅Π΅ Π² Π³Π°ΠΉΠ΄Π΅ β†’