Principal SoC Chip Lead (Semiconductors)

TL;DR

Principal SoC Chip Lead (Semiconductors): Owning end-to-end SoC program execution from project definition through tape-out and post-silicon support with an accent on technical leadership, cross-functional coordination, and delivery readiness. Focus on aligning architecture, RTL, verification, DFT, emulation, physical design, AMS, IP, and validation teams while solving critical execution risks and driving silicon bring-up.

Location: Shanghai (Pudong), China

Company

hirify.global develops semiconductor and SoC solutions for automotive, industrial, and other embedded applications.

What you will do

• Own SoC programs from definition through tape-out, silicon bring-up, validation, debug, and post-silicon support.
• Drive technical decisions across architecture, integration, verification, implementation, validation, and system engineering.
• Lead Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams.
• Build execution plans with PMO and SoC project management, monitor schedules and resources, and drive recovery actions.
• Manage technical dependencies, critical risks, stakeholder communication, and milestone readiness reviews.
• Coordinate tape-out signoff and post-silicon engineering resources for issue resolution.

Requirements

• Bachelor’s degree or higher in Microelectronics, Electrical Engineering, or a related discipline.
• At least 6 years of semiconductor industry experience.
• Proven SoC development experience from architecture through tape-out.
• Strong understanding of architecture, RTL design, integration, verification, DFT, emulation, physical design, and silicon validation flows.
• Experience leading large cross-functional engineering teams in a matrix organization.
• Strong project execution, planning, risk management, communication, and stakeholder management skills.

Nice to have

• Previous experience as a Chip Lead, SoC Technical Lead, Chief Engineer, or Project Technical Leader.
• Experience with automotive, industrial, or safety-critical semiconductor products.
• Experience working with global development teams across multiple sites.
• Successful delivery of multiple SoC tape-outs and post-silicon product ramps.

Culture & Benefits

• Cross-functional collaboration across architecture, design, verification, implementation, validation, product, and business teams.
• Work in a matrix organization with responsibility for technical influence and execution alignment.
• Focus on project delivery, risk reduction, customer needs, and measurable results.