External Package Innovation Engineer

Location: Kuala Lumpur, Malaysia

Company

Semiconductor company developing and advancing package innovation and next-generation packaging solutions.

What you will do

• Own OSAT-wide and cross-OSAT package innovation initiatives.
• Define and deploy standardized development templates, success criteria, best known methods, and lessons learned.
• Maintain technology roadmaps and capability assessments for OSAT sites.
• Provide package innovation input for external site sourcing and site selection.
• Lead project governance through project summaries, stoplight reporting, and regular OSAT reviews.
• Support NPI and NTI projects, resolve technical and project issues, and ensure assembly readiness and safe production launches.

Requirements

• Strong semiconductor packaging experience, including hands-on assembly processes such as pre-assembly and wire bonding.
• Experience managing cross-site, cross-functional projects.
• Solid understanding of NPI and NTI development flows.
• Ability to drive standardization, governance, and technical problem-solving.
• Strong stakeholder management and communication skills.

Nice to have

• Previous experience working with the OSAT ecosystem.

Culture & Benefits

• Collaboration with project leaders, development managers, designers, materials engineers, technology integration and modelling teams, SMEs, and OSAT partners.
• Exposure to global teams and external manufacturing partners.
• Opportunity to lead high-impact package innovation initiatives and contribute to next-generation packaging solutions.