Senior Manager, Semiconductor IC Packaging & Assembly Engineering

Location: Ipoh, Malaysia; onsite, with remote work unavailable

Company

hirify.global is an embedded semiconductor solution provider developing semiconductor solutions for automotive, industrial, infrastructure, IoT, and high-performance computing applications.

What you will do

• Lead sustaining engineering and high-volume manufacturing improvements across semiconductor package assembly technologies and product lines.
• Monitor yield, quality, cycle time, throughput, cost, and process-control performance using KPIs, dashboards, statistical analysis, and structured problem-solving methods.
• Investigate manufacturing, reliability, customer, and field-quality issues while coordinating containment, corrective, and preventive actions.
• Manage process changes involving materials, equipment, tooling, flows, and manufacturing sites, including qualification plans for transfers, second sourcing, equipment changes, and cost reductions.
• Drive NPI-to-HVM transfers through manufacturability reviews, package-process integration, readiness planning, process optimization, and ramp execution.
• Coordinate global OSAT and contract manufacturing partners, including technical reviews, audits, benchmarking, qualification, performance tracking, and cost improvement.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline.
• 10+ years of semiconductor manufacturing and packaging engineering experience, including IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
• 3+ years of experience leading technical projects, mentoring engineers, or managing small engineering teams in semiconductor manufacturing.
• Strong expertise in wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging processes.
• Deep knowledge of yield analysis, SPC, DOE, reliability, process control, package and process qualification, statistical analysis, semiconductor quality systems, and change management.
• Experience managing global OSAT partners and outsourced manufacturing ecosystems, including subcontractor benchmarking, selection, qualification, and technical management.

Nice to have

• Master’s degree or PhD in Engineering or a related field.
• Experience with 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, advanced interconnects, DBC, and AMB substrates.
• Experience with power semiconductor, SiC, GaN, automotive, AI/data center infrastructure power, or high-performance computing manufacturing.
• Knowledge of JEDEC, IPC, and customer qualification requirements.
• Experience working with geographically distributed engineering teams and global manufacturing operations.

Culture & Benefits

• Work within a diverse organization of more than 21,000 professionals across over 30 countries.
• Access career development opportunities across four Product Groups and corporate functions.
• Contribute to power-efficient semiconductor products and solutions for global customers.
• Participate in a flexible and inclusive work environment with global support systems and Employee Resource Groups.