Manager, Semiconductor IC Packaging & Assembly Engineering

Location: Shah Alam, Malaysia; remote work is not available

Company

hirify.global is an embedded semiconductor solution provider developing semiconductor solutions for automotive, industrial, infrastructure, IoT, and high-performance computing applications.

What you will do

• Support sustaining engineering and manufacturing execution across semiconductor IC package assembly technologies and product lines.
• Improve yield, cycle time, quality, throughput, cost, process stability, and production controls using structured problem-solving methods.
• Monitor manufacturing KPIs and yield trends, investigate process and quality issues, and coordinate root-cause and corrective-action activities.
• Support process changes, qualification plans, documentation, and manufacturing readiness for material, equipment, tooling, flow, and site changes.
• Support NPI-to-high-volume manufacturing transfers, ramp execution, manufacturability reviews, and package-process integration.
• Coordinate technical activities with Package Engineering, Product Engineering, Quality, Reliability, Supply Chain, suppliers, and global OSAT partners.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical discipline.
• 8+ years of semiconductor manufacturing and packaging engineering experience, including IC assembly, package development, qualification, and NPI-to-HVM transfers.
• At least 1 year of experience leading technical projects, coordinating engineering activities, or mentoring engineers.
• Strong knowledge of wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, power packaging, and advanced packaging technologies.
• Experience with yield analysis, SPC, DOE, reliability, process controls, package and process qualification, statistical analysis, quality systems, and change management.
• Experience working with global OSAT partners, subcontractors, and outsourced manufacturing ecosystems.

Nice to have

• Master’s degree or PhD in Engineering or a related field.
• Experience with 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, advanced interconnects, DBC, and AMB substrates.
• Knowledge of SiC, GaN, power semiconductor, automotive, AI/data center infrastructure, or high-performance computing manufacturing requirements.
• Experience with geographically distributed engineering teams and knowledge of JEDEC, IPC, and customer qualification requirements.

Culture & Benefits

• Flexible and inclusive work environment with a people-first culture.
• Remote work options are available within the broader company, but not for this role.
• Opportunities to develop technical and business skills across product groups and corporate functions.
• Global support system and Employee Resource Groups.
• Work focused on sustainable, power-efficient semiconductor solutions.