Die Prep Module Engineer (Pick and Place)

Location: On-site in Kulim, Malaysia. Shift 1 (Malaysia).

Company

hirify.global's Wafer Packaging Manufacturing group develops factory solutions for semiconductor packaging, high-density modular assembly, computing, and connectivity.

What you will do

• Own, stabilize, and optimize pick-and-place process parameters.
• Drive systematic yield improvement and resolve process integration issues.
• Lead complex equipment troubleshooting and preventive and corrective maintenance strategies.
• Collaborate with tool vendors on hardware and software upgrades.
• Use SPC, DOE, FMEA, and structured data analysis to identify root causes of process drift and equipment failures.
• Partner with process owners and R&D teams to transfer and ramp new products, standardize procedures, and document technical findings.

Requirements

• Bachelor's or master's degree in electrical, electronics, mechanical, mechatronics, or materials engineering.
• Minimum 2 years of work experience; fresh graduates are also welcome to apply.
• Knowledge of semiconductor back-end assembly, especially die preparation and pick-and-place processes, is advantageous.
• Basic understanding of SPC, statistical data analysis, and structured problem-solving methodologies.
• DOE, FMEA, and root cause analysis expertise is advantageous.
• Strong communication skills and the ability to collaborate across functions and present technical data clearly.

Culture & Benefits

• Full-time hirify.global contract employee role.
• Work in a collaborative, innovation-driven semiconductor manufacturing environment.
• Hands-on impact on factory yield, equipment uptime, OEE, and process stability.
• Participation in hirify.global's packaging roadmap and next-generation silicon technology delivery.