R&D Engineer Hardware (Semiconductor)

TL;DR

R&D Engineer Hardware (Semiconductor): Coordinating process development and defect improvement between internal teams and wafer sort contract manufacturers with an accent on semiconductor manufacturing processes. Focus on optimizing bumping, dicing, and backgrind operations to ensure timely delivery and quality.

Location: Penang, Malaysia (Onsite)

Company

A global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

What you will do

• Act as the primary technical interface between internal R&D, NPI, Packaging, and QA teams and the wafer sort contract manufacturer.
• Collaborate closely with the contract manufacturer on process development, improvement, and defect-related activities.
• Manage various wafer sort contract manufacturer activities.
• Work independently with minimum supervision to set priorities and ensure timely delivery.

Requirements

• Bachelor, Master, or PhD degree in Electrical or Electronic engineering.
• Minimum 5 years (preferably 8 years) of experience in wafer foundry or wafer sort process fields.
• In-depth knowledge of processes such as bumping, dicing, backgrind, and tape & reel.
• Fluent proficiency in both Chinese and English.
• Must be based in Penang, Malaysia.

Nice to have

• Skills in data analysis, programming, or AI.