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Packaging Module Engineer (Manufacturing)

8 253 - 15 741$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Packaging Module Engineer (Manufacturing): Designing and developing innovative packaging solutions for advanced semiconductor products with an accent on secure transportation and optimal performance. Focus on improving manufacturing processes, ensuring regulatory compliance, and enhancing cost-efficiency through DFM and SPC.

Location: On-site in Phoenix, Arizona, US

Salary: $99,030 - $188,890 USD

Company

A global leader in semiconductor technology and manufacturing.

What you will do

  • Design, develop, and qualify packaging solutions and materials meeting product and regulatory requirements.
  • Lead development processes including concepts, prototypes, qualification testing, and technical documentation.
  • Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure operational alignment.
  • Implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
  • Conduct risk analysis and benchmark packaging designs against industry standards.
  • Evaluate and qualify vendors to ensure high-quality manufacturing startup and scalability.

Requirements

  • Master's degree in Engineering, Physics, Chemistry, or related STEM field (1+ years exp) or PhD (6+ months exp).
  • Experience in product packaging assembly processes and production methodologies.
  • Proficiency in Statistical Process Control (SPC) principles and Design of Experiments (DOE) techniques.
  • Strong analytical skills for data analysis and risk assessment methods.
  • Knowledge of Design for Manufacturing (DFM) practices and packaging test criteria.
  • Must be based in or have work authorization for the US (onsite role in Phoenix, AZ).

Nice to have

  • Experience with Surface Mount Technologies, solder joint reliability, and package certification.
  • Experience leading technical teams and managing resources in a matrixed environment.
  • Familiarity with semiconductor device fabrication processes and packaging flows.

Culture & Benefits

  • Competitive total compensation package including stock bonuses.
  • Comprehensive health, retirement, and vacation programs.
  • Investment in employee development through every stage of life.

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