обновлено 3 дня назад
Packaging Module Engineer (Manufacturing)
8 253 - 15 741$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Packaging Module Engineer (Manufacturing): Designing and developing innovative packaging solutions for advanced semiconductor products with an accent on secure transportation and optimal performance. Focus on improving manufacturing processes, ensuring regulatory compliance, and enhancing cost-efficiency through DFM and SPC.
Location: On-site in Phoenix, Arizona, US
Salary: $99,030 - $188,890 USD
Company
A global leader in semiconductor technology and manufacturing.
What you will do
- Design, develop, and qualify packaging solutions and materials meeting product and regulatory requirements.
- Lead development processes including concepts, prototypes, qualification testing, and technical documentation.
- Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure operational alignment.
- Implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
- Conduct risk analysis and benchmark packaging designs against industry standards.
- Evaluate and qualify vendors to ensure high-quality manufacturing startup and scalability.
Requirements
- Master's degree in Engineering, Physics, Chemistry, or related STEM field (1+ years exp) or PhD (6+ months exp).
- Experience in product packaging assembly processes and production methodologies.
- Proficiency in Statistical Process Control (SPC) principles and Design of Experiments (DOE) techniques.
- Strong analytical skills for data analysis and risk assessment methods.
- Knowledge of Design for Manufacturing (DFM) practices and packaging test criteria.
- Must be based in or have work authorization for the US (onsite role in Phoenix, AZ).
Nice to have
- Experience with Surface Mount Technologies, solder joint reliability, and package certification.
- Experience leading technical teams and managing resources in a matrixed environment.
- Familiarity with semiconductor device fabrication processes and packaging flows.
Culture & Benefits
- Competitive total compensation package including stock bonuses.
- Comprehensive health, retirement, and vacation programs.
- Investment in employee development through every stage of life.
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