Advanced Packaging Design Engineer

TL;DR

Advanced Packaging Design Engineer: Leading advanced packaging and system validation design solutions for the Photonic Fabric Business unit with an accent on multi-chip SiP packaging and high-speed interface specifications. Focus on driving package layout, netlist management for heterogeneous chiplet assemblies, and collaborating with cross-functional teams to ensure thermo-mechanical reliability.

Location: Must be based in Santa Clara, CA

Salary: $191,530–$286,900 per annum

Company

hirify.global is a global leader in semiconductor solutions, providing essential infrastructure for data centers, cloud, AI, and enterprise architectures.

What you will do

• Lead Si/package/PCB/system co-design work in collaboration with system and ASIC/PIC design teams.
• Scope package substrate design feasibility for multi-chip SiP packaging.
• Manage package layout including routing, thermal, mechanical, and manufacturability requirements.
• Ensure compliance with high-speed interface specifications such as HBM, DDR, PCIe, and SerDes.
• Manage netlists for heterogeneous chiplet assemblies using advanced EDA solutions.
• Collaborate with substrate vendors and OSATs to drive production, assembly, and reliability qualification.

Requirements

• Must be eligible to access export-controlled information under U.S. law.
• BS/MS/PhD in EE, ECE, MSE, ME, ChemE, or related disciplines.
• 5-10 years of experience in Semiconductor Advanced Packaging Design.
• Extensive experience with advanced packaging design tools such as Cadence APD.
• Proven track record with high-density interconnects in 2.5D/3D technologies like InFO, CoWoS, FoCoS, and EMIB.
• Expert understanding of cross-functional packaging areas including thermal, mechanical, SI/PI, and design for manufacturing.

Nice to have

• Familiarity with photonics packaging.
• Experience with MCAD tools such as AutoCAD.

Culture & Benefits

• Comprehensive benefits package covering financial well-being, family support, and health.
• Employee stock purchase plan with a 2-year look back.
• Robust mental health resources and support programs.
• Recognition and service awards for contributions and milestones.

Hiring process

• Interviews are conducted in real-time to evaluate individual experience and communication skills.
• Use of AI tools during interviews is strictly prohibited and will result in disqualification.