Package Architect (Semiconductor)

TL;DR

Package Architect (Semiconductor): Serving as a subject matter expert on semiconductor packaging and assembly to formulate strategy and roadmaps for the Low Power Distribution & Protection product group. Focus on driving innovation, leading cross-functional NPI projects, and optimizing package design performance through advanced technical leadership.

Location: Must be based in Richardson, TX (Hybrid: up to 3 days remote per week).

Company

hirify.global is a global leader in semiconductors, specializing in high-volume production of essential components for automotive, industrial, and consumer applications.

What you will do

• Formulate and execute package strategy and roadmaps for the Low Power Distribution & Protection product group.
• Act as a site-level technical leader and subject matter expert in semiconductor packaging.
• Analyze technology and application trends to derive innovative design concepts and patentable solutions.
• Lead cross-functional teams for New Product Introduction (NPI) packaging projects.
• Advise internal and external customers on complex packaging and assembly challenges.
• Ensure the functionality and performance of package designs through rigorous testing and analysis.

Requirements

• Bachelor’s degree in Electronics Engineering, Mechanical Design, Physics, Materials, or related field.
• Minimum 8 years of progressive post-baccalaureate experience in the semiconductor industry.
• 7 years of experience with semiconductor packages, assembly materials, and assembly processes.
• 7 years of experience with 6sigma methodology, including DoE and data analysis.
• 7 years of experience with semiconductor reliability testing and failure mode analysis.
• 5 years of experience in project management within the semiconductor sector.

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups like the Pride Network and Women's groups.
• Support for professional growth and technical leadership development.
• Inclusive recruitment process with reasonable adjustments provided upon request.
• Global company environment with opportunities to influence product group directions.