Packaging Architect Design Engineer

TL;DR

Packaging Architect Design Engineer: Architect advanced packaging solutions to meet future semiconductor product requirements with an accent on GDSII-based physical layout and 2.5D/3D technologies. Focus on defining design rules, designing test vehicles, generating design collaterals, and driving design-for-yield and design-for-cost activities.

Location: Onsite at Irvine, CA, USA (Alton Parkway Bldg 2)

Salary: $91,000 - $146,000

Company

Global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.

What you will do

• Architect advanced packaging solutions for future products
• Define design rules for new technologies
• Design test vehicles with physical layout to support technology development
• Generate design collaterals for new technology introduction
• Drive design-for-yield and design-for-cost activities post-production

Requirements

• Bachelor's degree in Engineering + 5+ years related experience or Master's + 3+ years
• Intensive hands-on experience in GDSII-based physical layout
• In-depth knowledge of advanced 2.5D/3D packaging architecture and technology
• Skills in MCM-based layout (plus)
• Must be eligible to work in USA

Culture & Benefits

• Competitive base salary, discretionary annual bonus, and equity
• Medical, dental, vision plans
• 401(K) with company matching, ESPP, EAP
• Paid holidays, sick leave, vacation, family leave