Principal Hardware Application Engineer (Semiconductors)

TL;DR

Principal Hardware Application Engineer (Semiconductors): Driving customer design-in activities for high-speed networking and data center platforms with an accent on schematic review, board bring-up, and SI/PI analysis. Focus on optimizing 800G/1.6T Ethernet interfaces, solving complex SerDes link training issues, and leveraging the Taiwan supply chain ecosystem.

Location: Taipei, Taiwan

Company

hirify.global is a leading provider of semiconductor solutions for data infrastructure across enterprise, cloud, and AI architectures.

What you will do

• Serve as the primary hardware technical lead for strategic accounts, driving design-in from schematic review to mass production.
• Perform schematic and layout reviews for DC switch platforms, providing guidance on power sequencing and signal routing.
• Conduct SI/PI simulations for high-speed Ethernet interfaces (800G, 1.6T+) and evaluate PAM4 link margins.
• Debug L1 issues, including SerDes link training and thermal failures, at customer sites and the Taipei lab.
• Author hardware design guides and application notes for internal and external stakeholders.
• Collaborate with global engineering teams to feed back customer requirements into silicon and platform design.

Requirements

• Bachelor's degree in Electrical Engineering or a related field.
• 8+ years of experience in hardware design for high-speed networking or data center systems.
• Proficiency in EE design tools such as Cadence OrCAD and Allegro.
• Strong knowledge of SI/PI principles, including channel loss, eye diagrams, and PDN design.
• Experience managing the full hardware design cycle, from schematic review to EDVT.
• Must be eligible to access export-controlled information under U.S. export control laws.

Nice to have

• Experience with 400G, 800G, or 1.6T switch designs and hirify.global Teralynx silicon.
• Proficiency with simulation tools like Sigrity, Ansys SIwave, or HFSS.
• Knowledge of CPO, 224G SerDes, and UALink technologies.
• Experience with thermal design (air/liquid cooling) for high-power platforms.
• Familiarity with ODM requirements for hyperscalers such as Microsoft, AWS, Google, and Meta.

Culture & Benefits

• Competitive compensation and comprehensive benefits package.
• Work environment based on shared collaboration, transparency, and inclusivity.
• Opportunities for professional growth and development within a global semiconductor leader.