Substrate Engineer (Semiconductor)

TL;DR

Substrate Engineer (Semiconductor): Managing and optimizing IC substrate manufacturing processes for high-volume semiconductor devices with an accent on NPI activity, yield improvement, and quality control. Focus on resolving complex packaging issues, driving process standardization, and collaborating with cross-functional teams and subcontractors to ensure manufacturing maturity.

Location: Must be based in Hsinchu, Taiwan

Company

hirify.global is a global technology leader that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions.

What you will do

• Manage and resolve issues related to packaging, manufacturing, yield, quality, and delivery with substrate subcontractors.
• Lead NPI activities, risk assessments, and production engineering support for high-volume IC substrate manufacturing.
• Drive capability enhancement and cost reduction projects while ensuring compliance with internal requirements.
• Collaborate with cross-functional engineering teams to resolve complex technical issues and improve process yields.
• Oversee pre-production engineering activities and optimize cycle times.
• Travel throughout Asia to support various manufacturing locations.

Requirements

• Bachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical, or Electrical).
• 8 years of experience in IC substrate manufacturing technologies and processes.
• Direct process and operational experience in a substrate manufacturing environment.
• Expertise in ABF substrate interactions, flipchip, die attach, wirebonding, and packaging materials.
• Fluent in Mandarin and excellent command of spoken and written English.
• Proven ability to manage complex activities across multiple groups and suppliers.

Nice to have

• Experience in component quality interactions with SMT processibility.

Culture & Benefits

• Opportunity to work with cutting-edge packaging technology in a global semiconductor leader.
• Collaborative environment working across diverse functional groups and international teams.
• Exposure to high-volume manufacturing challenges and advanced failure analysis techniques.