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3 часа Π½Π°Π·Π°Π΄

IC Packaging Design & Layout Engineer

82Β 300 - 220Β 000$
Π€ΠΎΡ€ΠΌΠ°Ρ‚ Ρ€Π°Π±ΠΎΡ‚Ρ‹
onsite
Π’ΠΈΠΏ Ρ€Π°Π±ΠΎΡ‚Ρ‹
fulltime
Π“Ρ€Π΅ΠΉΠ΄
senior
Английский
b2
Π‘Ρ‚Ρ€Π°Π½Π°
US
Вакансия ΠΈΠ· списка Hirify.GlobalВакансия ΠΈΠ· Hirify Global, списка ΠΌΠ΅ΠΆΠ΄ΡƒΠ½Π°Ρ€ΠΎΠ΄Π½Ρ‹Ρ… tech-ΠΊΠΎΠΌΠΏΠ°Π½ΠΈΠΉ
Для мэтча ΠΈ ΠΎΡ‚ΠΊΠ»ΠΈΠΊΠ° Π½ΡƒΠΆΠ΅Π½ Plus

ΠœΡΡ‚Ρ‡ & Π‘ΠΎΠΏΡ€ΠΎΠ²ΠΎΠ΄

Для мэтча с этой вакансиСй Π½ΡƒΠΆΠ΅Π½ Plus

ОписаниС вакансии

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TL;DR

IC Packaging Design & Layout Engineer (Hardware): Creating advanced integrated circuit packaging solutions for next-generation hardware platforms with an accent on package architecture and signal integrity. Focus on designing substrates and interposers, performing SI/PI simulations, and collaborating with cross-functional teams to ensure manufacturability.

Location: Cambridge, MA. Applicants must be able to obtain and maintain a US government security clearance.

Salary: $82,300 - $220,000

Company

hirify.global is an independent, nonprofit research and development company that tackles national challenges in military defense, space exploration, and biomedical engineering.

What you will do

  • Lead concept development for advanced packages, including fan-out wafer level, 2.5D/3D interposers, and system-in-package (SiP).
  • Produce detailed layouts for substrates, interposers, and die-to-die routing using Siemens Xpedition.
  • Define and own the package-level SI/PI strategy, including high-speed digital interfaces and power delivery network (PDN) design.
  • Conduct SPICE, EM, and S-parameter simulations to validate signal integrity, PDN, and crosstalk.
  • Partner with mechanical and silicon engineers to co-optimize die floorplans, thermal interface materials, and molding.
  • Serve as the primary technical interface for substrate vendors, assembly houses, and OSATs.

Requirements

  • Bachelor's degree in electrical engineering or a related field (Advanced degree preferred).
  • 5-10 years of professional experience in electrical engineering.
  • Proficiency with high-density substrate and packaging layout tools, specifically Siemens Xpedition.
  • Experience with SI/PI analysis using Ansys SIwave, HFSS, Hyperlynx, or similar industry-standard tools.
  • Ability to obtain and maintain a US government security clearance.

Culture & Benefits

  • Work-life balance support including workplace flexibility.
  • Diverse employee clubs (photography, yoga) and health and finance workshops.
  • Off-site social events and discounts to local museums and cultural activities.
  • Commitment to an inclusive, high-performance culture with equal opportunity.

Π‘ΡƒΠ΄ΡŒΡ‚Π΅ остороТны: Ссли Ρ€Π°Π±ΠΎΡ‚ΠΎΠ΄Π°Ρ‚Π΅Π»ΡŒ просит Π²ΠΎΠΉΡ‚ΠΈ Π² ΠΈΡ… систСму, ΠΈΡΠΏΠΎΠ»ΡŒΠ·ΡƒΡ iCloud/Google, ΠΏΡ€ΠΈΡΠ»Π°Ρ‚ΡŒ ΠΊΠΎΠ΄/ΠΏΠ°Ρ€ΠΎΠ»ΡŒ, Π·Π°ΠΏΡƒΡΡ‚ΠΈΡ‚ΡŒ ΠΊΠΎΠ΄/ПО, Π½Π΅ Π΄Π΅Π»Π°ΠΉΡ‚Π΅ этого - это мошСнники. ΠžΠ±ΡΠ·Π°Ρ‚Π΅Π»ΡŒΠ½ΠΎ ΠΆΠΌΠΈΡ‚Π΅ "ΠŸΠΎΠΆΠ°Π»ΠΎΠ²Π°Ρ‚ΡŒΡΡ" ΠΈΠ»ΠΈ ΠΏΠΈΡˆΠΈΡ‚Π΅ Π² ΠΏΠΎΠ΄Π΄Π΅Ρ€ΠΆΠΊΡƒ. ΠŸΠΎΠ΄Ρ€ΠΎΠ±Π½Π΅Π΅ Π² Π³Π°ΠΉΠ΄Π΅ β†’