Advanced Packaging SI/PI Senior Engineer (Semiconductor)

TL;DR

Advanced Packaging SI/PI Senior Engineer (Semiconductor): Support and optimize SI/PI analysis for 2D/2.5D/3D package designs with an accent on signal and power integrity sign-off. Focus on automating simulation workflows, optimizing electrical performance with IP teams, and advancing 3D packaging and co-packaged optics.

Location: Westborough, MA. Applicants must be eligible to access export-controlled information under U.S. law.

Company

A leading semiconductor solutions provider for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Perform SI/PI analysis and optimization for 2D, 2.5D, and 3D package designs.
• Execute simulation tasks for signal and power integrity sign-off.
• Develop scripts to automate simulation setup, data extraction, and post-processing workflows.
• Collaborate with physical designers and IP teams to optimize electrical performance.
• Conduct wiring studies for signal routing and power delivery verification.
• Support internal EDA tooling projects and document analysis results for internal teams.

Requirements

• BS in Electrical/Computer Engineering with 3+ years of experience, or an MS in a related technical field.
• Hands-on experience with signal integrity (SI) and power delivery (PI) concepts.
• Proficiency with simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity.
• Working knowledge of circuit extraction and simulation techniques.
• Ability to write scripts for simulation automation and data processing.
• Must be eligible to access export-controlled information (EAR).

Culture & Benefits

• Employee stock purchase plan with a 2-year look back.
• Comprehensive family support programs to help balance work and home life.
• Robust mental and physical health resources.
• Recognition and service awards for professional milestones.