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16 часов назад

Packaging Technical Program Manager (Semiconductor)

120 320 - 236 810$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Packaging Technical Program Manager (Semiconductor): Leading cross-functional programs for advanced packaging manufacturing quality systems and phase gate execution with an accent on operational discipline and stakeholder alignment. Focus on driving program life cycles, managing complex dependencies across multi-site environments, and ensuring readiness for high-stakes semiconductor manufacturing outcomes.

Location: Must be based on-site in Phoenix, Arizona

Salary: $120,320–$236,810 USD

Company

A global leader in semiconductor manufacturing and technology innovation.

What you will do

  • Build and execute comprehensive program plans aligned with business objectives and phase gate requirements.
  • Lead cross-functional collaboration across manufacturing, quality, supplier, and customer-facing teams.
  • Create visibility into program health by tracking schedules, resources, risks, and key performance indicators.
  • Run milestone and readiness reviews to surface issues early and drive executive decision-making.
  • Clarify technical and quality requirements to ensure clear ownership and deliverables across partner teams.
  • Identify execution gaps and define mitigation plans to protect program stability.

Requirements

  • Bachelor’s degree in engineering, Technology, Operations, or Program Management.
  • 7+ years of experience in packaging technology, manufacturing, quality, or program management.
  • Proven ability to lead complex, cross-functional projects with measurable outcomes.
  • Strong experience in building project plans, managing schedules, and stakeholder communication.
  • Must be authorized to work in the US without sponsorship.
  • Must be able to work on-site in Phoenix, Arizona.

Nice to have

  • Master’s degree in a relevant discipline.
  • 10+ years of experience in semiconductor manufacturing or advanced packaging environments.
  • Experience with quality systems, 8D problem solving, or Quality Review Board governance.
  • Background in deploying automation, dashboards, and performance management systems.

Culture & Benefits

  • Competitive total compensation package including pay and stock bonuses.
  • Comprehensive health and retirement benefit programs.
  • Opportunities for high-visibility work on advanced technology programs.
  • Collaborative environment focused on operational excellence and innovation.

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