Packaging Module Development Engineer (AI)

TL;DR

Packaging Module Development Engineer (Semiconductor): Developing assembly processes and equipment for future packaging platform technologies with an accent on manufacturing efficiency, quality, and reliability. Focus on optimizing physical layouts, designing experiments (DOE), and integrating AI/ML for process improvement.

Location: On-site in Phoenix, Arizona, US

Salary: $133,800 - $219,550 USD

Company

hirify.global is a global leader in semiconductor manufacturing and innovation.

What you will do

• Develop assembly processes and equipment to enable future packaging platform technologies.
• Optimize manufacturing efficiency to meet strict quality, reliability, cost, and yield requirements.
• Establish material specifications for contract assemblers and raw material vendors.
• Innovate and solve complex packaging problems using experimental design and statistical methods.
• Ensure manufacturability of physical package layouts and oversee process flows.
• Create tools and quality screens for early identification of reliability issues.

Requirements

• Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics, or related STEM with 3+ years of experience, or PhD with 1+ years of experience.
• Regular on-site presence in Phoenix, Arizona is required.
• Minimum cumulative GPA of 3.5.
• Experience with Statistical Process Control (SPC) and Design of Experiments (DOE) in semiconductor or advanced manufacturing.
• Proficiency in Python or MATLAB development with knowledge of AI and ML concepts.
• Hands-on laboratory or prototype development experience.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work with industry-leading technology and a global team of experts.