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Package Development, Signal Integrity And Power Integrity Engineer, Principal (Semiconductors)

168 400 - 249 310$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR

Principal Package Development, Signal Integrity And Power Integrity Engineer (Semiconductors): Developing advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond with an accent on electrical design, modeling, and characterization. Focus on ensuring signal and power integrity, managing package suppliers, and optimizing for manufacturability and reliability.

Location: Westlake Village, CA

Salary: $168,400 - $249,310 per annum

Company

hirify.global provides semiconductor solutions that serve as essential building blocks for data infrastructure across enterprise, cloud, and AI architectures.

What you will do

  • Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.
  • Execute electrical design, modeling, and characterization, focusing on all signal and power integrity aspects.
  • Interface with package suppliers to select technology, drive layout, and ensure compliance with performance and cost requirements.
  • Collaborate with marketing and IC designers to develop achievable package specifications.
  • Manage cross-functional coordination between assembly development, IC physical layout, and analog/digital designers.

Requirements

  • Bachelor's degree in EE/CS with 5-8 years of experience, or Master's/PhD with 1-3 years of experience.
  • Strong fundamentals in EM, transmission lines, and microwave theory.
  • Experience with 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, or Cadence Clarity.
  • Proficiency in circuit design tools (Spectre, ADS, HSpice) and automation using Python.
  • Hands-on experience with VNA and TDR measurements for package and PCB characterization.
  • Must be eligible to access US export-controlled information as defined under EAR.

Nice to have

  • Experience with 2.5D/3D package development.
  • Familiarity with Co-Packaged Optics and Optics packaging.
  • Knowledge of thermal and mechanical analysis of IC packages.
  • Track record of new product introduction from concept through production.
  • Experience with channel simulations using MATLAB or ADS.

Culture & Benefits

  • Employee stock purchase plan with a 2-year look back.
  • Comprehensive family support programs to balance work and home life.
  • Robust mental and physical health resources.
  • Recognition and service awards to celebrate milestones.

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