Package Design Engineer (AI)

Location: San Jose, California, USA. On-site at the hirify.global office 5 days per week; this is not a remote-work position.

Salary: USD 121,900–195,000 annual base salary, plus discretionary annual bonus and equity awards.

Company

hirify.global develops semiconductor and infrastructure technology, including high-performance ASICs for AI, networking, high-performance computing, and 5G applications.

What you will do

• Own the design of complex flip-chip-BGA packages for high-performance ASICs.
• Design critical package structures for 224G-and-higher SerDes, ADC/DAC, DDR, HBM, and related technologies.
• Address signal integrity, power integrity, manufacturability, reliability, and thermal requirements.
• Perform physical package design and layout as a foundational responsibility.
• Schedule, prioritize, and track work across two or more projects while managing customer interfaces.
• Improve design-team efficiency through process development, automation, and documentation.

Requirements

• BSEE or a similar degree with 8+ years of flip-chip-BGA package-design experience, including high-speed SerDes, or an MSEE or similar degree with 6+ years of experience.
• Knowledge of package-level signal integrity and power integrity.
• Experience with Cadence APD, Allegro Package Designer, or an equivalent tool.
• Ability to collaborate with worldwide teams across multiple time zones, including internal engineers and external vendor designers.
• Strong self-management and organizational skills.
• Availability to work on-site at the San Jose office five days per week.

Nice to have

• One or more years of experience with Cadence SKILL for Allegro or similar design-automation coding.
• Interest in design automation and process improvement.

Culture & Benefits

• Collaboration within a worldwide R&D team.
• Medical, dental, and vision plans.
• 401(k) participation with company matching and an Employee Stock Purchase Program.
• Paid holidays, sick leave, vacation, family leave, and other applicable leaves of absence.
• Eligibility for discretionary bonuses and new-hire and annual equity awards.