ASIC Package Design Manager (AI)

Location: On-site at the hirify.global office in Fort Collins, Colorado, USA, five days a week. Occasional travel may be required.

Annual base salary: USD 143,800–230,000, plus discretionary bonus and equity awards.

Company

hirify.global develops high-performance semiconductor and ASIC technologies for AI, networking, high-performance computing, and 5G infrastructure.

What you will do

• Lead and develop an engineering team designing complex flip-chip-BGA packages for advanced ASICs.
• Create and track project plans for 20 or more concurrent package designs, including scope, schedules, and resources.
• Coordinate team, customer, vendor, and cross-functional activities to keep projects on track.
• Communicate project plans, status, next steps, and risks across stakeholders.
• Create package-design methodologies and steer package technology and design rules.
• Support co-design activities with internal engineers and external vendor designers across multiple time zones.

Requirements

• BSEE, MSEE, or a similar degree.
• 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes, with at least 3 years of management experience.
• Experience managing people and projects.
• Knowledge of package-level signal integrity and power integrity.
• Technical understanding of package-design lifecycles, ASIC manufacturing flows, package data, layouts, SI/PI extraction and simulation, DFx trade-offs, mechanical and thermal modeling, automation code development, project management, and new-business quotes.
• Strong self-management, organization, communication, and collaboration skills.

Culture & Benefits

• Worldwide R&D collaboration across multiple time zones.
• Medical, dental, and vision plans.
• 401(k) participation with company matching and an employee stock purchase program.
• Paid holidays, sick leave, vacation time, and applicable family-leave benefits.
• Employee assistance program, discretionary annual bonus, and equity awards.