Hardware Technical Program Manager (AI)

Location: Austin, Texas; full-time on-site position

Salary: $160,000–$195,000 per year plus equity

Company

hirify.global is developing silicon-photonic and programmable-metasurface technology for energy-efficient, high-performance AI inference hardware.

What you will do

• Drive the Electronic IC program from architecture and specification through tapeout, post-silicon bring-up, system integration, and production readiness.
• Own integrated schedules, milestones, dependencies, staffing outlook, risk registers, readiness checklists, and executive status reporting.
• Coordinate architecture, RTL, digital, analog/mixed-signal, DV, DFT, physical design, packaging, photonics, board, firmware, and software teams.
• Manage foundry, IP vendor, EDA vendor, design-services, and OSAT relationships, including PDK updates, wafer starts, tapeout logistics, and mask releases.
• Lead verification closure, timing and physical signoff, DRC/LVS, tapeout decisions, lab readiness, ATE planning, silicon debug, errata tracking, and respin scoping.
• Deploy AI and LLM tooling across requirements, specifications, scheduling, verification, documentation, status reporting, and engineering workflows.

Requirements

• 10+ years of ASIC/SoC development experience in TPM, EPM, or an equivalent technical leadership role.
• At least two complete silicon programs delivered from architecture or specification through tapeout at a reputable foundry, including one taken through post-silicon bring-up to production or system integration.
• Working knowledge of the full silicon lifecycle, including architecture, front-end design, verification, FPGA/emulation, physical design, DFT, signoff, packaging, foundry manufacturing, bring-up, ATE, and qualification.
• Experience managing foundry, IP vendor, OSAT, and design-services relationships and coordinating cross-functional teams without direct authority.
• BS in Electrical or Computer Engineering or equivalent; MS preferred.
• Fluent daily use of AI tools with sound judgment about human verification of AI output.

Nice to have

• Mixed-signal or high-speed analog experience, including SerDes, data converters, drivers, TIAs, optical transceivers, or silicon photonics.
• Advanced packaging experience with 2.5D/3D integration, interposers, CoWoS, or hybrid bonding.
• First-silicon, startup, ML accelerator, data-center hardware, or prior design, DV, or physical-design experience.
• Experience with PDR/CDR gate reviews, requirements management, and AI-assisted EDA or agentic engineering workflows.

Culture & Benefits

• Collaborative startup environment focused on silicon photonics, AI, and next-generation computing.
• 100% coverage of base health plan premiums for employees and dependents, with HSA contributions.
• Unlimited PTO and flexible personalized benefits.
• 401(k) matching, stock option opportunities, and voluntary dental, vision, life, hospital, critical illness, and accident insurance.