8 дней назад
Principal Physical Design Engineer (ASIC/SoC)
180 000 - 260 000$
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Описание вакансии
Текст:
TL;DR
Principal Physical Design Engineer (ASIC/SoC): Owning complex physical implementation from floorplanning and synthesized netlists through signoff with an accent on timing closure, power integrity, signal integrity, and physical verification. Focus on solving advanced-node implementation problems, driving multi-mode multi-corner analysis, and developing automation and methodologies for high-performance semiconductor designs.
Location: Remote
Salary: $180,000–$260,000 per year, plus equity, benefits, and 401(k)
Company
develops complex semiconductor and ASIC/SoC designs.
What you will do
- Own physical implementation of complex blocks and subsystems from synthesized netlist through signoff.
- Develop floorplans and implementation strategies covering hierarchy, macros, congestion, timing, power, and routability.
- Drive placement, optimization, clock-tree synthesis, routing, extraction, timing closure, ECOs, and top-level timing convergence.
- Lead physical verification and power-integrity activities, including DRC, LVS, antenna, density, connectivity, IR drop, and electromigration analysis.
- Partner with RTL, architecture, DFT, verification, package, SI/PI, and other engineering teams to resolve cross-functional design issues.
- Improve physical design flows, scripts, automation, metrics, and methodologies while mentoring other engineers.
Requirements
- 10+ years of ASIC or SoC physical design experience with multiple successful tapeouts.
- Expertise in floorplanning, placement, CTS, routing, optimization, timing closure, ECOs, and physical verification.
- Strong experience with static timing analysis, multi-mode multi-corner timing closure, clock design, variation, extraction, power delivery, IR drop, electromigration, and signal integrity.
- Experience with Cadence and/or Synopsys physical implementation and signoff tools.
- Strong scripting and automation skills using Tcl, Python, Perl, or similar languages.
- Ability to independently drive complex technical problems to closure and provide technical leadership without formal management authority.
Nice to have
- Experience with advanced process nodes and large, high-frequency, or highly interconnected semiconductor designs.
- Experience with hierarchical design, top-level physical integration, physical design methodologies, and automation.
- Experience with multi-die, chiplet, or advanced packaging architectures.
- Experience in an early-stage semiconductor environment and familiarity with EDA tool evaluation and benchmarking.
Culture & Benefits
- Remote position within a highly collaborative, fast-paced engineering organization.
- Opportunity to join as an early member of the physical design team.
- Meaningful equity, benefits, and 401(k).
- Technical mentorship, design reviews, methodology reviews, and tapeout readiness work.
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