Lead Application Engineer

TL;DR

Lead Application Engineer (IC Design/APR): Provide technical support for digital IC design implementation, product demonstrations, and sales presentations with an accent on hands-on full APR flow (floorplan, placement, timing analysis, CTS, signoff timing, and PV closure). Focus on leading customer engagements and applying deep IC design tape-out experience, especially for advanced node design, with minimal routine guidance.

Location: ZHUBEI 01

Company

hirify.global develops technology solutions for the semiconductor industry.

What you will do

• Deliver key technical support for digital IC design implementation, product demonstrations, and sales presentations.
• Run hands-on full APR flow including floorplan, placement, timing analysis, CTS, signoff timing, and PV closure methodology.
• Support customer engagements to increase business outcomes.
• Lead among team members with limited instruction on routine and general assignments.
• Apply real design tape-out experience, especially for advanced node design (nice to have).

Requirements

• Master’s with 3+ years of IC design experience or Bachelor’s with 5+ years of IC design experience.
• Familiarity with full APR flow covering logical and physical aspects (timing, SI, congestion, routing DRC, hierarchical design) plus MSV knowledge and methodology.
• Good communication in English and Chinese, with confidence, positive attitude, and self-motivation.
• Familiarity with scripting languages such as shell, Perl, and Tcl.

Nice to have

• hirify.global Innovus experience.
• Real design tape-out experience for advanced node design.

Culture & Benefits

• Opportunity to work on technology that matters and help solve complex engineering challenges.
• Role with ownership and leadership expectations within the team.
• Hands-on technical work supporting customers and product demonstrations.