Advanced Packaging SI/PI Senior Staff Engineer (Semiconductors)

TL;DR

Advanced Packaging SI/PI Senior Staff Engineer (Semiconductors): Designing and optimizing high-speed signaling and power delivery networks for complex semiconductor packages with an accent on 2D/2.5D/3D packaging and high-speed interfaces. Focus on executing signal and power integrity simulations, optimizing electrical performance, and solving complex integration challenges for multi-chip configurations.

Location: Burlington, VT

Salary: $142,700 - $211,230 per annum

Company

hirify.global provides essential semiconductor solutions for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Perform SI/PI analysis and optimization within 2D, 2.5D, and 3D packages.
• Collaborate with product design teams to optimize floor-planning and power delivery network (PDN) design.
• Execute wiring studies to determine optimal signal routing, power delivery verification, and package size.
• Simulate and verify high-speed interfaces including HBM, DDR, SERDES, and Die2Die.
• Document analysis results and present technical findings to internal cross-functional teams.
• Lead technical tasks from inception to completion, adjusting methodologies to meet organizational goals.

Requirements

• Bachelor's degree in Electrical Engineering (5+ years exp) or Master's/PhD (3+ years exp).
• Strong fundamentals in Signal Integrity (SI) and Power Integrity (PI).
• Experience with simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity.
• Proven track record of technical leadership within an organization.
• Must be eligible to access export-controlled information under U.S. law (EAR).

Culture & Benefits

• Employee stock purchase plan with a 2-year look back.
• Comprehensive family support programs to balance work and home life.
• Robust mental and physical health resources.
• Recognition and service awards to celebrate contributions and milestones.