CUF TD Module Engineer (Semiconductor)

TL;DR

CUF TD Module Engineer (Semiconductor Packaging): Developing assembly processes and equipment for capillary underfill (CUF) modules with an accent on process optimization, reliability, and manufacturability. Focus on designing experiments, evaluating silicon/package technologies under simulated field conditions, and innovating packaging platforms for the AI era.

Location: Regular on-site presence required in Kulim, Malaysia

Company

hirify.global Foundry focuses on state-of-the-art semiconductor manufacturing and advanced packaging technology leadership for the AI era.

What you will do

• Develop and optimize assembly processes and equipment for CUF (capillary underfill) modules.
• Improve manufacturing efficiency to meet quality, reliability, cost, yield, and productivity requirements.
• Create process and equipment specifications using design of experiments (DOE) and data analysis.
• Evaluate silicon and package technologies under simulated field use conditions such as heat, humidity, and temperature cycles.
• Establish material specifications for contract assemblers and raw material vendors, ensuring strict adherence to quality standards.
• Lead innovation and problem-solving efforts using experimental design and statistical methods to improve packaging reliability.

Requirements

• MSc/PhD in Mechanical, Material, Electrical, Chemical Engineering, or Physics with a focus on thermal/fluid/packaging assembly.
• Bachelor's degree with strong relevant experience may also be considered.
• At least 3 years of professional working experience.
• Fundamental understanding of semiconductor assembly equipment and processes.
• Location: Must be based in or be able to work on-site in Kulim, Malaysia.

Culture & Benefits

• Opportunity to work within a worldwide factory network developing compute devices.
• Exposure to cutting-edge silicon process and packaging technology leadership.
• Commitment to Responsible Business Alliance (RBA) compliance and ethical hiring practices.
• Transparent recruitment process with no candidate-paid fees.