DACA Engineer (Die Attach Process)

Location: Seremban, Malaysia

Company

Semiconductor manufacturing organization focused on die attach assembly processes and stable production performance.

What you will do

• Monitor and sustain die attach manufacturing processes for stable production performance.
• Analyze process trends, yield excursions, and defect data to identify improvement opportunities.
• Lead root cause investigations and implement corrective and preventive actions.
• Support new product introductions, process qualifications, package qualifications, and engineering evaluations.
• Define and execute process characterization studies and Design of Experiments (DOE).
• Collaborate with equipment suppliers and internal teams to improve equipment capability, utilization, quality, productivity, and cycle time.

Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical and Electronic Engineering, Materials Engineering, Manufacturing Engineering, Chemical Engineering, or an equivalent technical discipline.
• 5–8 years of experience in semiconductor assembly manufacturing.
• Direct experience with Die Attach / DACA processes is highly preferred.
• Experience preparing technical reports, work instructions, and process documentation.
• A master’s degree is an advantage.

Culture & Benefits

• Full-time employment in an onsite manufacturing environment.
• Inclusive recruitment process and equal-opportunity workplace.
• Reasonable workplace adjustments are provided where requested.
• Access to employee resource groups, including Pride Network and women’s groups.