DACA Engineer (Semiconductors)

TL;DR

DACA Engineer (Semiconductors): Developing, optimizing, and sustaining die attach manufacturing processes within semiconductor assembly with an accent on product quality, reliability, and manufacturing efficiency. Focus on leading root cause investigations, executing process characterization studies (DOE), and optimizing equipment capability.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a leading semiconductor manufacturer focused on delivering high-quality components and promoting an inclusive, diverse workplace.

What you will do

• Monitor and sustain die attach manufacturing processes to ensure stable production performance.
• Analyze process trends, yield excursions, and defect data to identify improvement opportunities.
• Lead root cause investigations and implement effective corrective and preventive actions.
• Support new product introductions, process qualifications, and engineering evaluations.
• Define and execute process characterization studies and Design of Experiments (DOE).
• Collaborate with equipment suppliers and internal teams to improve equipment capability and utilization.

Requirements

• Bachelor's Degree in Mechanical, Electrical & Electronic, Materials, Manufacturing, or Chemical Engineering.
• 5–8 years of experience in semiconductor assembly manufacturing.
• Direct experience in Die Attach / DACA processes is highly preferred.

Culture & Benefits

• Commitment to diversity and inclusion with a goal of 30% women in management by 2030.
• Inclusive and accessible recruitment process for all applicants.
• Safe work environment with reasonable adjustments provided upon request.
• Access to employee resource groups, including the Pride Network and global/local Women's groups.