Semiconductor Package Competitive Analysis Intern (Semiconductors)

TL;DR

Semiconductor Package Competitive Analysis Intern (Semiconductors): Supporting the Package Innovation team in building competitive intelligence through structured analysis of semiconductor packaging technologies and market trends with an accent on data mining of competitor product releases and teardown reports. Focus on synthesizing large datasets into actionable insights and creating executive-ready reports on technology differentiation.

Location: Kuala Lumpur, Malaysia

Company

hirify.global is a global leader in secure connectivity solutions for embedded applications.

What you will do

• Perform structured data mining of competitor product releases, PCNs, teardown reports, and technology announcements
• Develop insights on packaging trends, cost/performance positioning, and technology differentiation
• Conduct startup and emerging technology evaluations relevant to advanced packaging
• Consolidate findings into clear, executive-ready reports and dashboards for leadership
• Maintain and enhance competitive analysis databases and tracking frameworks
• Participate in manufacturing projects to gain foundational understanding of semiconductor assembly processes

Requirements

• Degree candidate in Materials Science, Mechanical, Electrical Engineering, or related field
• Strong analytical mindset with ability to synthesize large datasets into actionable insights
• Proficient in Excel and PowerPoint
• Familiarity with AI tools and advanced search techniques for efficient data mining
• Strong communication skills with ability to clearly present findings