обновлено 14 дней назад
Semiconductor Package Competitive Analysis Intern (Advanced Packaging)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Semiconductor Package Competitive Analysis Intern (Advanced Packaging): Building competitive intelligence on semiconductor packaging technologies, market trends, and competitor activities with an accent on structured data mining, technology evaluation, and cost/performance analysis. Focus on synthesizing large datasets, evaluating startups and emerging technologies, and creating executive-ready reports and dashboards for Package Innovation leadership.
Location: Kuala Lumpur, Malaysia
Company
develops semiconductor technologies and packaging solutions.
What you will do
- Mine competitor product releases, PCNs, teardown reports, and technology announcements.
- Analyze packaging trends, cost/performance positioning, and technology differentiation.
- Evaluate startups and emerging technologies relevant to advanced semiconductor packaging.
- Prepare executive-ready reports and dashboards for Package Innovation leadership.
- Maintain and improve competitive analysis databases and tracking frameworks.
- Participate in ATKL manufacturing projects to build an understanding of semiconductor assembly processes.
Requirements
- Currently pursuing a degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Strong analytical skills and the ability to synthesize large datasets into actionable insights.
- Proficiency in Excel and PowerPoint.
- Strong communication skills and the ability to present findings clearly.
Nice to have
- Experience with data analysis or visualization.
- Familiarity with AI tools and advanced search techniques for efficient data mining.
Culture & Benefits
- Full-time internship within the Package Innovation team.
- Practical exposure to semiconductor assembly and manufacturing projects.
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