Packaging Development Engineer (Semiconductors)

TL;DR

Packaging Development Engineer (Semiconductors): Leading process assembly development and validation for semiconductor packaging with an accent on statistical data analysis and process qualification. Focus on designing experiments, creating process recipes, and transferring developments to high-volume production.

Location: Kuala Lumpur (Onsite)

Company

hirify.global is a global leader in secure connectivity solutions for embedded applications.

What you will do

• Lead and execute projects for process assembly development and validation.
• Design and analyze process-related experiments using statistical software.
• Create and qualify process recipes for transfer to high-volume production.
• Establish new production specifications and procedures.
• Mitigate manufacturing risks and lead Task Force Teams.
• Share best practices and lessons learned across manufacturing sites.

Requirements

• Bachelor’s degree in Engineering or Sciences (Master or PhD preferred).
• Strong aptitude in statistical data analysis and problem solving.
• Pro-activeness in leading process characterization and ability to handle new challenges.
• Basic knowledge of project planning and experience driving small projects.
• Excellent communication, presentation, and interpersonal skills.
• Ability to meet process and project deadlines.