Packaging Module Development Engineer

TL;DR

Packaging Module Development Engineer: Developing and optimizing electronic packaging assembly processes, specifically in Solder Ball Attach and Chip Attach, with an accent on technology development and high-volume manufacturing transfer. Focus on conducting fundamental studies, performing Design of Experiments (DOE), and improving yield and reliability for advanced semiconductor products.

Location: On-site in Kulim, Malaysia

Company

hirify.global is a global leader in semiconductor manufacturing, providing cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Develop and qualify packaging assembly processes for new products and test vehicles.
• Conduct fundamental studies and experiments to characterize materials and identify potential failure modes.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, and productivity requirements.
• Document process improvements and technical findings through white papers.
• Collaborate with cross-functional teams to integrate material technologies into products.
• Manage the ramp-up of materials and processes for transfer to high-volume manufacturing.

Requirements

• BEng, MEng, MSc, or PhD in Mechanical, Materials, Chemical, Electrical Engineering, or Physics.
• Minimum 5 years of working experience in electronic packaging or process development.
• Proven experience in Chip Attach, Deflux, or Ball Attach processes.
• Strong capabilities in data analysis, problem-solving, and statistical process control (SPC).
• Excellent written and verbal communication skills.
• Ability to work under tight timelines and perform under pressure.

Nice to have

• Research and Development background from MSc or PhD programs.

Culture & Benefits

• Opportunity to work in a worldwide factory network on state-of-the-art semiconductor technology.
• Commitment to ethical hiring practices and Responsible Business Alliance (RBA) compliance.
• Inclusive work environment with equal opportunity employment policies.