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3 дня назад

Software Engineering Director/Architect (AI)

Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Software Engineering Director/Architect (AI): Building scalable EDA flows and AI-driven automation for advanced 3DIC applications with an accent on flow-generation, debugging assistance, and platform integration. Focus on developing LLM-based automation, root-cause analysis capabilities, and optimizing complex package and system-level design workflows.

Location: Austin, USA (Onsite)

Company

hirify.global is a leading provider of intelligent systems design software, hardware, and IP for the semiconductor and electronics industries.

What you will do

  • Build scalable EDA flows using C++, Tcl, Python, and Java.
  • Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis.
  • Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
  • Design and automate workflows to improve usability, productivity, and debug efficiency for complex package and system-level design.
  • Collaborate with cross-functional engineering teams to define requirements, validate behavior, and deliver production-quality solutions.

Requirements

  • Strong background in EDA data structures and algorithms.
  • Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
  • Experience with DB-driven design flows, such as Innovus or similar implementation platforms.
  • Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
  • Knowledge of constraint-driven design, including timing, signal integrity, and DRC.
  • Experience handling large-scale design problems, including high bump-count designs and multi-region routing.

Nice to have

  • Experience with 3DIC, 3.5D, or 2.5D designs.
  • Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging.
  • Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation.
  • Knowledge of multi-tool integration and end-to-end flow automation.

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