HBI Module Development Engineer (Advanced Packaging)

TL;DR

HBI Module Development Engineer (Advanced Packaging): Driving equipment development and manufacturability for next-generation die-to-wafer hybrid bonding technologies with an accent on high-performance computing, AI, and chiplet architectures. Focus on optimizing bond interface quality, improving yield, and leading first-of-a-kind (FOK) platform development.

Location: Hybrid (US, Oregon, Hillsboro)

Salary: $155,520–$298,440 USD

Company

hirify.global is a global leader in semiconductor innovation, creating processors and advanced packaging solutions to power the future of computing and AI.

What you will do

• Drive process and equipment development for die-to-wafer hybrid bonding, including parameter optimization and process control.
• Optimize manufacturing processes to improve yield, reliability, and defectivity performance.
• Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows.
• Partner with equipment suppliers and materials vendors to develop hardware solutions.
• Collaborate with technology development and manufacturing organizations to drive process maturity.

Requirements

• Bachelor's degree (9+ years exp), Master's (6+ years exp), or PhD (5+ years exp) in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field.
• 5+ years of industry experience in hybrid bonding, wafer bonding, or advanced packaging.
• Must be based in or able to work in a hybrid model at the Hillsboro, Oregon site.
• Demonstrated ability to solve complex technical problems using structured engineering methodologies.
• Strong written and verbal communication skills for presenting technical findings.

Nice to have

• Experience leading FOK process or equipment development programs.
• Knowledge of bond interface defect mechanisms, including void formation and adhesion challenges.
• Experience with alignment-sensitive manufacturing and overlay performance optimization.
• Experience supporting technology transfer from development to high-volume manufacturing.

Culture & Benefits

• Competitive compensation package including pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Hybrid work model allowing a split between on-site and off-site work.
• Opportunity to work on cutting-edge packaging technologies for AI and HPC.